Paper Title:

Atomic Layer Deposition of Thin Inorganic Coatings onto Renewable Packaging Materials

Periodical Solid State Phenomena (Volume 185)
Main Theme Advanced Structural and Functional Materials for Protection
Edited by Ma Jan and Santhiagu Ezhilvalavan
Pages 12-14
DOI 10.4028/www.scientific.net/SSP.185.12
Citation Mika Vähä-Nissi et al., 2012, Solid State Phenomena, 185, 12
Online since February, 2012
Authors Mika Vähä-Nissi, Terhi Hirvikorpi, Jenni Sievänen, Katriina Matilainen, Erkki Salo, Ali Harlin
Keywords Aluminium Oxide, Atomic Layer Deposition, Barrier, Biopolymer, Packaging Material
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Abstract

Biopolymers play still a relatively minor role in the packaging material markets. For this to grow further there are problems to be solved, such as inadequate barrier properties and moisture sensitivity. Atomic layer deposition (ALD) is one potential solution. Atomic layer deposition is a layer-by-layer thin film deposition process based on self-limiting gas-solid reactions. It is well suited for producing pinhole free barrier coatings uniform in thickness at relatively mild process conditions. The purpose of this presentation is to summarize our recent work done concerning atomic layer deposition of thin aluminum oxide layers onto biopolymers.