Main Theme:

Ultra Clean Processing of Semiconductor Surfaces X

Volume 187
doi: 10.4028/www.scientific.net/SSP.187
Paper Titles published in this Main Theme:
Paper Title Page

Preface, Committees and Sponsors

Exploratory Materials and Devices to Advance CMOS beyond the Classical Si Roadmap

Authors: Marc M. Heyns

3

Scanning Probe Microscopy Imaging before and after Atomic Layer Oxide Deposition on a Compound Semiconductor Surface

Authors: W. Melitz, J.B. Clemens, J. Shen, E.A. Chagarov, S. Lee, J.S. Lee, J.E. Royer, M. Holland, S. Bentley, D. McIntyre, I. Thayne, R. Droopad, A.C. Kummel

9

Optimized Post-CMP and Pre-Epi Cleans to Enable Smooth and High Quality Epitaxial Strained Ge Growth on SiGe Strain Relaxed Buffers

Authors: Roger Loo, Laurent Souriau, Patrick Ong, Karine Kenis, Jens Rip

15

Cleaning and Surface Preparation for SiGe and Ge Channel Device

Authors: Masayuki Wada, H. Takahashi, James Snow, Rita Vos, Thierry Conard, Paul W. Mertens, H. Shirakawa

19

S-Passivation of the Ge Gate Stack Using (NH4)2S

Authors: Sonja Sioncke, Claudia Fleischmann, Dennis Lin, Evi Vrancken, Matty Caymax, Marc Meuris, Kristiaan Temst, André Vantomme, Matthias Müller, Michael Kolbe, Burkhard Beckhoff

23

Wet Chemical Cleaning of InP and InGaAs

Authors: Rita Vos, Sophia Arnauts, Thierry Conard, Alain Moussa, Herbert Struyf, Paul W. Mertens

27

Achieving Ultra-Shallow Junctions in Future CMOS Devices by a Wet Processing Technique

Authors: Joel Barnett, Richard Hill, Prashant Majhi

33

Effect of Wet Cleanings on GST Surface: XPS Characterization

Authors: Annamaria Votta, Francesco Pipia, Enrica Ravizza, Simona Spadoni, Silvia Rossini, Lucilla Brattico, Mauro Alessandri

37

Study of the Etching Mechanism of Heavily Doped Si in HF

Authors: Nick Valckx, Daniel Cuypers, Rita Vos, Harold Philipsen, Jens Rip, Geert Doumen, Paul W. Mertens, Marc M. Heyns, Stefan de Gendt

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