Paper Title:
Exploratory Materials and Devices to Advance CMOS beyond the Classical Si Roadmap
| Periodical | Solid State Phenomena (Volume 187) |
|---|---|
| Main Theme | Ultra Clean Processing of Semiconductor Surfaces X |
| Edited by | Paul Mertens, Marc Meuris and Marc Heyns |
| Pages | 3-5 |
| DOI | 10.4028/www.scientific.net/SSP.187.3 |
| Citation | Marc M. Heyns, 2012, Solid State Phenomena, 187, 3 |
| Online since | April, 2012 |
| Authors | Marc M. Heyns |
| Keywords | CMOS, Germanium, High-k, III/V, TunnelFET |
| Price | US$ 28,- |
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Abstract
The megasonic cleaning efficiency is evaluated as a function of the angle of incidence of acoustic waves on a Si wafer. Acoustic Schlichting streaming alone is not able to remove nanoparticles smaller than 400 nm. It is shown that oscillating or collapsing behavior of bubbles are responsible for removing nanoparticles smaller than 400 nm during a cleaning process with ultrasound. Optimal particle removal efficiency is obtained around the angle of acoustic transmission of the silicon wafer.
