Paper Title:

Poly-Silicon Wet Removal for Replacement Gate Integration Scheme: Impact of Process Parameters on the Removal Rate

Periodical Solid State Phenomena (Volume 187)
Main Theme Ultra Clean Processing of Semiconductor Surfaces X
Edited by Paul Mertens, Marc Meuris and Marc Heyns
Pages 53-56
DOI 10.4028/www.scientific.net/SSP.187.53
Citation Farid Sebaai et al., 2012, Solid State Phenomena, 187, 53
Online since April, 2012
Authors Farid Sebaai, Anabela Veloso, Martine Claes, Katia Devriendt, Stephan Brus, Philippe Absil, Paul W. Mertens, Stefan de Gendt
Keywords Contaminant Species, Diluted Ammonia, Diluted TMAH Solution, Dopant, Poly-Silicon, Poly-Silicon Opening, Replacement Gate
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Abstract

We report in this work some process optimization effort in performing poly silicon removal for replacement gate process integration. Successful wet poly silicon removal after dummy gate patterning is not only conditioned by suitable process conditions during wet removal but is also impacted by process steps prior to gate removal A thorough evaluation of the impact on poly removal from dopants or contaminants introduced in the poly silicon by previous processing is done, resulting in an optimized integration flow with successful poly removal. This work also shows that use of diluted TMAH chemistry instead of diluted ammonia in performing poly silicon removal provides better ability in removing poly silicon especially in narrow gate structures.