Paper Title:
TEM Investigations on the Structure and Stability of Diffusion Barriers for VLSI Contacts
  Abstract

  Info
Periodical
Solid State Phenomena (Volumes 19-20)
Edited by
M. Kittler and H. Richter
Pages
611-616
DOI
10.4028/www.scientific.net/SSP.19-20.611
Citation
S. Hopfe, M. Reiche, "TEM Investigations on the Structure and Stability of Diffusion Barriers for VLSI Contacts", Solid State Phenomena, Vols. 19-20, pp. 611-616, 1991
Online since
January 1991
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Price
$32.00
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