Paper Title:
SOI by Silicon Wafer Direct Bonding - Problems of Wafer Warpage and Surface Chemistry
  Abstract

  Info
Periodical
Solid State Phenomena (Volumes 19-20)
Edited by
M. Kittler and H. Richter
Pages
625-630
DOI
10.4028/www.scientific.net/SSP.19-20.625
Citation
G. Kissinger, W. Kissinger, H. Hofmann, J. Krüger, "SOI by Silicon Wafer Direct Bonding - Problems of Wafer Warpage and Surface Chemistry", Solid State Phenomena, Vols. 19-20, pp. 625-630, 1991
Online since
January 1991
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.