Main Theme:
Gettering and Defect Engineering in Semiconductor Technology VI
Volumes 47 - 48
doi:
10.4028/www.scientific.net/SSP.47-48
Paper Titles published in this Main Theme:
| Paper Title |
Page |
|
Trends and Challenges for Advanced Silicon Technologies
Authors: C. Claeys, L. Deferm
|
1
|
|
Needs of Low Thermal Budget Processing in SiGe Technology
Authors: U. König, J. Hersener
|
17
|
|
History and Future of Semiconductor Wafer Bonding
Authors: U.M. Gösele, H. Stenzel, Manfred Reiche, T. Martini, H. Steinkirchner, Q.-Y. Tong
|
33
|
|
Building the Electron Superhighway: Back-End Processing and Simulation
Authors: F.H. Baumann
|
45
|
|
Role of Interstitial Atoms in Microscopic Processes on (113) and (001) Surfaces of Silicon
Authors: Jaroslaw DÄ…browski, Hans Joachim Müssig, G. Wolff
|
57
|
|
Silicon Materials and Metrology: Critical Concepts for Optimal IC Performance in the Gigabit Era
Authors: Howard R. Huff, R.K. Goodall
|
65
|
|
Expected Limits for Manufacturing Very Large Silicon Wafers
Authors: W. v. Ammon
|
97
|
|
Diameter Effects on Grown-In Defects in CZ Crystal Growth
Authors: F. Uberti, K. Hagimoto
|
107
|
|
Silicon Carbide - A Promising Wide-Band-Gap Semiconductor for Electronic Devices
Authors: Gerhard Pensl, T. Troffer
|
115
|
|
Multicrystalline Silicon for Solar Cells
Authors: Hans Joachim Möller
|
127
|
Showing 1 to 10 of 74 Paper Titles