History and Future of Semiconductor Wafer Bonding |
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| Journal | Solid State Phenomena (Volumes 47 - 48) |
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| Volume | Gettering and Defect Engineering in Semiconductor Technology VI |
| Edited by | H. Richter, M. Kittler and C. Claeys |
| Pages | 33-44 |
| DOI | 10.4028/www.scientific.net/SSP.47-48.33 |
| Authors | U.M. Gösele, H. Stenzel, Manfred Reiche, T. Martini, H. Steinkirchner, Q.-Y. Tong |
| Full Paper | 
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