Paper Title:
History and Future of Semiconductor Wafer Bonding
  Abstract

  Info
Periodical
Solid State Phenomena (Volumes 47-48)
Edited by
H. Richter, M. Kittler and C. Claeys
Pages
33-44
DOI
10.4028/www.scientific.net/SSP.47-48.33
Citation
U.M. Gösele, H. Stenzel, M. Reiche, T. Martini, H. Steinkirchner, Q.-Y. Tong, "History and Future of Semiconductor Wafer Bonding", Solid State Phenomena, Vols. 47-48, pp. 33-44, 1996
Online since
July 1995
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Price
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