Paper Title:
Implementation of Low Thermal Budget Techniques to Si and SiGe MOSFET Device Processing
  Abstract

  Info
Periodical
Solid State Phenomena (Volumes 57-58)
Edited by
C. Claeys, J. Vanhellemont, H. Richter and M. Kittler
Pages
413-418
DOI
10.4028/www.scientific.net/SSP.57-58.413
Citation
M. Glück, J. Hersener, H.G. Umbach, J. Rappich, J. Stein, "Implementation of Low Thermal Budget Techniques to Si and SiGe MOSFET Device Processing", Solid State Phenomena, Vols. 57-58, pp. 413-418, 1997
Online since
July 1997
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.