A Quantitative Method of Metal Impurities Depth Profiling for Gettering Evaluation in Silicon Wafers |
| Journal |
Solid State Phenomena (Volumes 57 - 58) |
| Volume |
Gettering and Defect Engineering in Semiconductor Technology VII |
| Edited by |
C. Claeys, J. Vanhellemont, H. Richter and M. Kittler |
| Pages |
81-90 |
| DOI |
10.4028/www.scientific.net/SSP.57-58.81 |
| Authors |
Mohammad B. Shabani,
T. Yoshimi,
S. Okuuchi,
A. Kaniava
|
| Keywords |
AAS, Bulk Decomposition, Depth-Profiling, Drop Etching, Drop Sandwich Etching, External Gettering, Gettering Evaluation, Internal Gettering, p/p+ epi, SIMOX |
| Full Paper |
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