Paper Title:
SOI by Silicon Dioxide Thermal Bonding
  Abstract

  Info
Periodical
Solid State Phenomena (Volumes 6-7)
Edited by
M. Kittler
Pages
561-564
DOI
10.4028/www.scientific.net/SSP.6-7.561
Citation
W. Kissinger, H. Hofmann, "SOI by Silicon Dioxide Thermal Bonding", Solid State Phenomena, Vols. 6-7, pp. 561-564, 1989
Online since
January 1989
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Price
$32.00
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