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Ultra Clean Processing of Silicon Surfaces IV

Volumes 65 - 66
doi: 10.4028/www.scientific.net/SSP.65-66
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Preface and Committees

The Rinsing Problem: Effect of Solute-Surface Interactions on Wafer Purity

Authors: Lee M. Loewenstein, Paul W. Mertens

1

Hydrogenated Ultrapure Water Production System for Future Wet Cleaning Process

Authors: Hiroshi Morita, Jun ichi Ida, T. Mizuniwa, Tadahiro Ohmi

7

Behaviour of Metallic Contaminants during Mos Processing

Authors: Twan Bearda, Stefan de Gendt, Lee M. Loewenstein, M. Knotter, Paul W. Mertens, Marc M. Heyns

11

Hydrogen Peroxide Decomposition in Ammonia Solutions

Authors: D. Martin Knotter, Stefan de Gendt, M. Baeyens, Paul W. Mertens, Marc M. Heyns

15

New Aspects of the Diluted Dynamic Clean Process

Authors: F. Tardif, T. Lardin, A. Maciejny, Adrien Danel, Pieter Boelen, C. Cowache, Ismail Kashkoush, R. Novak

19

Single Step Alkaline Cleaning Solution for Advanced Semiconductor Cleaning

Authors: M. Baeyens, W. Hub, Bernd O. Kolbesen, A.R. Martin, Paul W. Mertens

23

Particle Removal Efficiency and Silicon Roughness in HF-DIW/O3/Megasonics Cleaning

Authors: Mauro Alessandri, Enrico Bellandi, Francesco Pipia, F. Cazzaniga, K. Wolke, M. Schenkl

27

Industrial Trends in Wet Processing Technology

Authors: L.F.Tz. Kwakman, M. Geomini, Didier Lévy, D. Malgouyres

31

Particle Addition Behaviour of Oxide Stripping by HF Solutions

Authors: Enrico Bellandi, Mauro Alessandri, Francesco Pipia, A. Tonti

35

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