Applications of Tetramethylammoninium Hydroxide (TMAH) as a Post Tungsten CMP Cleaning Mixture |
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| Journal | Solid State Phenomena (Volumes 65 - 66) |
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| Volume | Ultra Clean Processing of Silicon Surfaces IV |
| Edited by | Marc Heyns, Marc Meuris and Paul Mertens |
| Pages | 105-108 |
| DOI | 10.4028/www.scientific.net/SSP.65-66.105 |
| Citation | M. Jolley, 1998, Solid State Phenomena, 65-66, 105 |
| Authors | M. Jolley |
| Keywords | CMP, Tungsten, Wafer Cleaning |
| Full Paper | 
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