Paper Title:

Integrated Cleaning: Application of Densified Fluid Cleaning (DFC) to Post-Etch Residue Removal

Periodical Solid State Phenomena (Volumes 65 - 66)
Main Theme Ultra Clean Processing of Silicon Surfaces IV
Edited by Marc Heyns, Marc Meuris and Paul Mertens
Pages 195-198
DOI 10.4028/www.scientific.net/SSP.65-66.195
Citation V. Starov et al., 1998, Solid State Phenomena, 65-66, 195
Authors V. Starov, D. Beery, Alex Kabansky
Keywords Post-Etch Residue Removal, Surface Preparation, Wafer Cleaning
Price US$ 28,-
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