Paper Title:
Post SiN Etching Cleaning During Copper and Low K Integration
  Abstract

  Info
Periodical
Solid State Phenomena (Volumes 76-77)
Edited by
Marc Heyns, Marc Meuris and Paul Mertens
Pages
101-104
DOI
10.4028/www.scientific.net/SSP.76-77.101
Citation
A. Beverina, D. Louis, C. Arvet, E. Lajoinie, P. Besson, C. Peyne, D. Holmes, D. Maloney, S. Lee, W.M. Lee, "Post SiN Etching Cleaning During Copper and Low K Integration", Solid State Phenomena, Vols. 76-77, pp. 101-104, 2001
Online since
January 2001
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Price
$32.00
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