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Influence of Cleaning on the Quality of the Bonding Interface in Direct Bonded Silicon Wafers

Journal Solid State Phenomena (Volumes 76 - 77)
Volume Ultra Clean Processing of Silicon Surfaces V
Edited by Marc Heyns, Marc Meuris and Paul Mertens
Pages 173-176
DOI 10.4028/www.scientific.net/SSP.76-77.173
Citation W.A. Nevin et al., 2001, Solid State Phenomena, 76-77, 173
Authors W.A. Nevin, D.L. Gay, G. O'Neill
Keywords Impurity Gettering, Silicon Bonding, Si-Si Interface
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