Influence of Cleaning on the Quality of the Bonding Interface in Direct Bonded Silicon Wafers |
|
| Journal | Solid State Phenomena (Volumes 76 - 77) |
|---|---|
| Volume | Ultra Clean Processing of Silicon Surfaces V |
| Edited by | Marc Heyns, Marc Meuris and Paul Mertens |
| Pages | 173-176 |
| DOI | 10.4028/www.scientific.net/SSP.76-77.173 |
| Citation | W.A. Nevin et al., 2001, Solid State Phenomena, 76-77, 173 |
| Authors | W.A. Nevin, D.L. Gay, G. O'Neill |
| Keywords | Impurity Gettering, Silicon Bonding, Si-Si Interface |
| Full Paper |
Get the full paper by clicking here
|
