Paper Title:
Influence of Cleaning on the Quality of the Bonding Interface in Direct Bonded Silicon Wafers
  Abstract

  Info
Periodical
Solid State Phenomena (Volumes 76-77)
Edited by
Marc Heyns, Marc Meuris and Paul Mertens
Pages
173-176
DOI
10.4028/www.scientific.net/SSP.76-77.173
Citation
W.A. Nevin, D.L. Gay, G. O'Neill, "Influence of Cleaning on the Quality of the Bonding Interface in Direct Bonded Silicon Wafers", Solid State Phenomena, Vols. 76-77, pp. 173-176, 2001
Online since
January 2001
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Price
$32.00
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