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Post Copper CMP: a Two Steps Cleaning Recipe

Journal Solid State Phenomena (Volumes 76 - 77)
Volume Ultra Clean Processing of Silicon Surfaces V
Edited by Marc Heyns, Marc Meuris and Paul Mertens
Pages 299-302
DOI 10.4028/www.scientific.net/SSP.76-77.299
Citation Alessio Beverina et al., 2001, Solid State Phenomena, 76-77, 299
Authors Alessio Beverina, J.M. Fabbri, Didier Lévy, F. Tardif, Pascal Besson
Keywords Cleaning, CMP, Copper (Cu)
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