Wet Cleaning of Trenches and Vias after Oxide/Nitride Dry Etch with Cu Exposed |
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| Journal | Solid State Phenomena (Volumes 76 - 77) |
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| Volume | Ultra Clean Processing of Silicon Surfaces V |
| Edited by | Marc Heyns, Marc Meuris and Paul Mertens |
| Pages | 311-0 |
| DOI | 10.4028/www.scientific.net/SSP.76-77.311 |
| Citation | Steven Verhaverbeke et al., 2001, Solid State Phenomena, 76-77, 311 |
| Authors | Steven Verhaverbeke, Jason Chi-Hao Shao, Lewis Liu |
| Keywords | Cu Clean, Post Dry Etch Cleaning, Via Cleaning |
| Full Paper | 
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