New Aqueous Clean for Aluminum Interconnects: Part II. Applications |
| Journal |
Solid State Phenomena (Volumes 76 - 77) |
| Volume |
Ultra Clean Processing of Silicon Surfaces V |
| Edited by |
Marc Heyns, Marc Meuris and Paul Mertens |
| Pages |
51-54 |
| DOI |
10.4028/www.scientific.net/SSP.76-77.51 |
| Citation |
R. Ravikumar et al., 2001, Solid State Phenomena, 76-77, 51 |
| Authors |
R. Ravikumar, D.L. Rath, D.J. Delehanty, R.G. Filippi, E.W. Kiewra, G. Stojakovic, K.J. McCullough, D.D. Miura, J. Gambino, F. Schnabel, B.N. Rhoads |
| Keywords |
Post Al RIE Clean, Reliability, Via Clean |
| Full Paper |
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