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Investigation of Trace Metals Analyses of Dry Residue on Silicon Wafer Surfaces by TXRF and ICP-MS

Journal Solid State Phenomena (Volumes 76 - 77)
Volume Ultra Clean Processing of Silicon Surfaces V
Edited by Marc Heyns, Marc Meuris and Paul Mertens
Pages 75-80
DOI 10.4028/www.scientific.net/SSP.76-77.75
Citation Jiang Bo Wang et al., 2001, Solid State Phenomena, 76-77, 75
Authors Jiang Bo Wang, M. Balazs, Piero Pianetta, K. Baur, S. Brennan
Keywords Dry Residue, ICP-MS, SR-TXRF, TXRF, VPD, Wafer Surface
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