Paper Title:

Impact of Compressive Stress on the Formation of Thermal Donors in Heat-Treated Silicon

Periodical Solid State Phenomena (Volumes 82 - 84)
Main Theme Gettering anf Defect Engineering in Semiconductor Technology IX
Edited by V. Raineri, F. Priolo, M. Kittler and H. Richter
Pages 259-266
DOI 10.4028/www.scientific.net/SSP.82-84.259
Citation Andrzej Misiuk et al., 2001, Solid State Phenomena, 82-84, 259
Authors Andrzej Misiuk, Boris A. Andreev, Valentin V. Emtsev, Charalamos A. Londos, Gagik A. Oganesyan, D.S. Poloskin
Keywords Compressive Stress, Heat Treatment, Oxygen Aggregation, Silicon, Thermal Donor
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