Paper Title:
Impact of Compressive Stress on the Formation of Thermal Donors in Heat-Treated Silicon
  Abstract

  Info
Periodical
Solid State Phenomena (Volumes 82-84)
Edited by
V. Raineri, F. Priolo, M. Kittler and H. Richter
Pages
259-266
DOI
10.4028/www.scientific.net/SSP.82-84.259
Citation
A. Misiuk, B. A. Andreev, V. V. Emtsev, C. A. Londos, G. A. Oganesyan, D.S. Poloskin, "Impact of Compressive Stress on the Formation of Thermal Donors in Heat-Treated Silicon", Solid State Phenomena, Vols. 82-84, pp. 259-266, 2002
Online since
November 2001
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Price
$32.00
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