Paper Title:
Impact of Compressive Stress on the Formation of Thermal Donors in Heat-Treated Silicon
| Periodical |
Solid State Phenomena (Volumes 82 - 84)
|
| Main Theme |
Gettering anf Defect Engineering in Semiconductor Technology IX
|
| Edited by |
V. Raineri, F. Priolo, M. Kittler and H. Richter |
| Pages |
259-266 |
| DOI |
10.4028/www.scientific.net/SSP.82-84.259 |
| Citation |
Andrzej Misiuk et al., 2001, Solid State Phenomena, 82-84, 259 |
| Authors |
Andrzej Misiuk, Boris A. Andreev, Valentin V. Emtsev, Charalamos A. Londos, Gagik A. Oganesyan, D.S. Poloskin |
| Keywords |
Compressive Stress, Heat Treatment, Oxygen Aggregation, Silicon, Thermal Donor |
| Price |
US$ 28,- |