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Ultra Clean Processing of Silicon Surfaces VI

Solid State Phenomena Volume 92

• Papers
• Abstracts

• p1 Future Challenges for Cleaning in Advanced Microelectronics   [ 389 K ]
  Authors: Allen Bowling, Brian K. Kirkpatrick, Trace Hurd, Laura Losey, Phil Matz
• p7 Open Circuit Potential Analysis as a Fast Screening Method for the Quality of High-k Dielectric Layers   [ 210 K ]
  Authors: Martine Claes, T. Witters, G. Loriaux, S. Van Elshocht, A. Delabie, Stefan De Gendt, Marc M. Heyns, Harald Okorn-Schmidt
• p11 Wet Etch Enhancement of HfO₂ Films by Implant Processing   [ 230 K ]
  Authors: Joel Barnett, Deborah J. Riley, Troy C. Messina, Pat Lysaght, Ron Carpio
• p15 Behaviour of High-k Dielectric Materials with Classical Cleaning Chemistries   [ 172 K ]
  Authors: Enrico Bellandi, Barbara Crivelli, Mauro Alessandri
• p19 Introduction of High-k Materials into Wet Processing, Analysis and Behavior   [ 216 K ]
  Authors: Bart Onsia, David Hellin, M. Claes, A. Maes, Stefan De Gendt, Marc M. Heyns
• p23 Metallic Impurity Contamination from Tungsten Gate Cleaning   [ 250 K ]
  Authors: Geun Min Choi, Tadahiro Ohmi
• p27 Single Chemistry Cleaning Solutions for Advanced Wafer Cleaning   [ 335 K ]
  Authors: Rita Vos, Marcel Lux, Sophia Arnauts, Karine Kenis, M. Maes, Bart Onsia, James Snow, Frank Holsteyns, Guy Vereecke, Paul W. Mertens, Marc M. Heyns, O. Doll, A. Fester, Bernd O. Kolbesen, T. Hackett, Mark Hoffman
• p33 Single Chemistry Cleaning with Complexing Agents (CAs): Determination of CA-Lifetimes by UV/VIS-Spectroscopy   [ 241 K ]
  Authors: O. Doll, Bernd O. Kolbesen
• p37 Complexing Agents Employed in Single Chemistry Cleaning: Stability Studies Using HPLC   [ 208 K ]
  Authors: S. Metzger, Bernd O. Kolbesen
• p41 Stability and Residue Studies of Complexing Agents in SC-1 Bath   [ 185 K ]
  Authors: Heini Saloniemi, Simo Eränen, Raimo A. Ketola, Juha Kokkonen, Sari Lehto, Kaija Luomanperä, Pertti Vastamäki, Heli Sirén, Olli Anttila
• p45 Single Wafer Immersion Process Incorporating a Novel Megasonics Configuration with an Advanced IPA Vapor Condensation Dry   [ 247 K ]
  Authors: J.J. Rosato, E.G. Baiya, J.A. Imonigie, M.R. Yalamanchili, E. Hansen
• p49 Metallic Contamination Removal Evaluation for Single Wafer Processing   [ 222 K ]
  Authors: Pieter Boelen, Steven Verhaverbeke, Philippe Garnier, Didier Levy, Hitoshi Morinaga
• p53 Procedure to Evaluate Particle-Substrate Interaction during Immersion in Liquid   [ 223 K ]
  Authors: Wim Fyen, J. Vansteenbergen, Kai Dong Xu, Rita Vos, Paul W. Mertens, Marc M. Heyns
• p57 Surfactant Selection for AM Clean in a Single Wafer Oasis Wet System   [ 168 K ]
  Authors: Jennifer Baker, Christopher Beaudry, Hitoshi Morinaga, Steven Verhaverbeke
• p63 Investigating Post CMP Cleaning Processes for STI Ceria Slurries   [ 237 K ]
  Authors: Robert Small, Pascal Berar, Brandon Scott