Paper Title:
Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration
  Abstract

  Info
Periodical
Solid State Phenomena (Volume 92)
Edited by
Marc Heyns, Paul Mertens and Marc Meuris
Pages
263-266
DOI
10.4028/www.scientific.net/SSP.92.263
Citation
L. Broussous, O. Hinsinger, S. Favier, P. Besson, "Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration", Solid State Phenomena, Vol. 92, pp. 263-266, 2003
Online since
May 2003
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Price
$32.00
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