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Ultra Clean Processing of Silicon Surfaces VI

Solid State Phenomena Volume 92

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• p125 Evaluation of Organic Contamination on Si Wafers in Fab Environments   [ 182 K ]
  Authors: Joong S. Jeon, Colman Wong, Susanne Ohsiek, Hyeon S. Kim, Bob Ogle
• p129 Selective Wet Etching of High-k Gate Dielectrics   [ 155 K ]
  Authors: Kurt K. Christenson, Brent Schwab, Thomas J. Wagener, Bruce Rosengren, Deborah J. Riley, Joel Barnett
• p133 Investigation of Particle Removal from Silicon Surfaces by Means of Dry and Steam Laser Cleaning   [ 122 K ]
  Authors: P. Leiderer, M. Mosbacher, J. Boneberg, C. Bartels, F. Lang, Conrado R.M. Afonso, D. Baeuerle
• p135 A Comprehensive Model for Cleaning Semiconductor Wafers   [ 182 K ]
  Authors: Gretchen Burdick, Sean Eichenlaub, Neil Berman, Stephen Beaudoin
• p139 Effect of Transient pH on Particle Deposition during Immersion Rinsing   [ 236 K ]
  Authors: Wim Fyen, Kai Dong Xu, Rita Vos, Guy Vereecke, Paul W. Mertens, Marc M. Heyns
• p143 Influence of Hardware and Chemistry on the Removal of Nano-Particles in a Megasonic Cleaning Tank   [ 299 K ]
  Authors: Guy Vereecke, Marc M. Heyns, Rita Vos, Frank Holsteyns, M. Schmidt, M. Baeyens, S. Gomme, James Snow, Paul W. Mertens, V. Coenen, T. Bauer
• p147 Influence of Frequency on the Removal Efficiency of Nano-Particles in a Megasonic Spray Cleaning Tool   [ 243 K ]
  Authors: M. Schmidt, Guy Vereecke, Rita Vos, Frank Holsteyns, M. Baeyens, Paul W. Mertens
• p151 A Theoretical and Experimental Study of Damage-Free BEOL Cleaning with Megasonic Agitation   [ 358 K ]
  Authors: Jeffrey M. Lauerhaas, Yi Wu, Mario Bran, Brian Fraser, Eric Brause, Tom Nicolosi
• p157 Removal of Small (<100-nm) Particles and Metal Contamination in Single-Wafer Cleaning Tool   [ 244 K ]
  Authors: Atsuro Eitoku, James Snow, Rita Vos, M. Sato, S. Hirae, Kazuo Nakajima, M. Nonomura, M. Imai, Paul W. Mertens, Marc M. Heyns
• p161 Relation between Particle Density and Haze on a Wafer: a New Approach to Measuring Nano-Sized Particles   [ 262 K ]
  Authors: Kai Dong Xu, Rita Vos, Guy Vereecke, Marcel Lux, Wim Fyen, Frank Holsteyns, Karine Kenis, Marc M. Heyns, Paul W. Mertens, Chris Vinckier
• p165 TXRF Analysis of Low Z Elements and TXRF-NEXAFS Speciation of Organic Contaminants on Silicon Wafer Surfaces Excited by Monochromatized Undulator Radiation   [ 243 K ]
  Authors: Burkhard Beckhoff, R. Fliegauf, Gerhard Ulm, J. Weser, G. Pepponi, C. Streli, P. Wobrauschek, T. Ehmann, L. Fabry, S. Pahlke, B. Kanngießer, W. Malzer
• p171 Forced Vapour-Phase Decomposition (FVPD) in Combination with e.g. TXRF - a Method to Determine Contamination in Silicon   [ 269 K ]
  Authors: Ingrid Rink
• p175 On-Tool Real-Time Moisture Monitoring Provides Yield and Productivity Benefits   [ 280 K ]
  Authors: R.P. Davis, R.B. Grant, L. Papens, N. Stouten, Jan Van Hoeymissen, Marc M. Heyns
• p179 Effect of Preparation-Induced Surface Morphology on the Stability of H-Terminated Si(111) and Si(100) Surfaces   [ 246 K ]
  Authors: H. Angermann, W. Henrion, M. Rebien, A. Röseler
• p183 Thermal Evolution of (100) Silicon and Chemical Oxides as Seen by ATR Spectroscopy   [ 188 K ]
  Authors: F. Tardif, A. Chabli, Adrien Danel, Névine Rochat, Marc Veillerot