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Ultra Clean Processing of Silicon Surfaces VI

Solid State Phenomena Volume 92

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• p247 Alternative Post-Etch Polymer Removal in a Single-Wafer Platform   [ 211 K ]
  Authors: Curt Dundas, René Vroom, John Ghekiere, Patrick Van Doorne, Ingrid Rink, Ian Sharp, Seamus Heffernan
• p251 Ammonium Nitrate Cleaning Process for Post Metal Photo-Resister Removing   [ 124 K ]
  Authors: Chin-Hsin Lo, Fei Yuan Chen
• p255 Post Metal Etch Polymer Removal: A New CF₄-Based Dry Plasma Process Sequence   [ 199 K ]
  Authors: Maria Paola Pozzoli, Simona Petroni
• p259 Influences of Cleaning Conditions and Elapse after Etch on Via Resistance in Multi-Level Cu Interconnects   [ 248 K ]
  Authors: Uk Sun Hong, Sang Rok Hah, Byung Lyul Park, Chan Geun Park, Jun Hwan Oh, Hong Seong Son, Jeff Barnes, Ju Hyuk Chung, Kwang Myeon Park
• p263 Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration   [ 319 K ]
  Authors: Lucile Broussous, O. Hinsinger, Sylvie Favier, Pascal Besson
• p267 Resist Strip and Cu Diffusion Barrier Etch in Cu BEOL Integration Schemes in a Mattson Highlands^TM Chamber   [ 229 K ]
  Authors: G. Mannaert, Marc Van Cauwenberghe, M. Schmidt, Jan Van Aelst, D. Hendrickx, M. Stucchi, Thierry Conard, Serge Vanhaelemeersch, Werner Boullart
• p271 Corrosion Inhibaitors for Copper in Hydroxylamine-Based Chemistries Used for CMP and Post-CMP Cleaning   [ 232 K ]
  Authors: Subramanian Tamilmani, Wayne Huang, Srini Raghavan, Robert Small
• p275 Tribological Characterization of Post-CMP Brush Scrubbbing   [ 323 K ]
  Authors: Ara Philipossian, Lateef Mustapha
• p281 Defectivity Study of Cu Metallization Process by Dark- and Bright-Field Inspection   [ 256 K ]
  Authors: Laureen Carbonell, Frank Holsteyns, Zsolt Tőkei, Lisa O'Reilly, Karen Maex, Paul W. Mertens
• p287 New Dry Tool after Cleaning of Low-k Dielectrics   [ 238 K ]
  Authors: Seiichiro Okuda, Hiroaki Sugimoto, Akio Hashizume, Hiroki Tsujikawa, Masayoshi Imai, Gary Asai
• p293 Supercritical Carbon Dioxide Processing of Porous Methylsilsesquioxane(PMSQ) Low-k Dielectric Films   [ 337 K ]
  Authors: Hunter John Martinez, Thieu Jacobs, Josh Wolf, Laura Rothman
• p297 Supercritical Carbon Dioxide Cleaning of Low-k Material   [ 119 K ]
  Authors: Gary Asai, Y. Muraoka, K. Saito, I. Mizobata, T. Iwata, K. Masuda, K. Iijima, T. Yoshikawa, D. Peters
• p301 Removal of Heavy Organics by Supercritical CO₂   [ 265 K ]
  Authors: Akshey Sehgal, M.R. Yalamanchili, C. Millet, Adrien Danel, F. Tardif