Smart-Cut Process for Ultrathin SOI Wafers Manufacturing |
| Journal |
Solid State Phenomena (Volumes 95 - 96) |
| Volume |
Gettering and Defect Engineering in Semiconductor Technology X |
| Edited by |
H. Richter and M. Kittler |
| Pages |
1-10 |
| DOI |
10.4028/www.scientific.net/SSP.95-96.1 |
| Citation |
Christophe Maleville, 2003, Solid State Phenomena, 95-96, 1 |
| Authors |
Christophe Maleville |
| Keywords |
300mm, Haze, High Volume Manufacturing, Nano-Uniformity, Smart-Cut®, Surface Nanotopography, Thickness Uniformity, Ultrathin SOI, Unibond, Wafer Bonding |
| Full Paper |
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