Papers by keyword «Simulation»
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Computer Simulation of Diffusion in Disordered Systems
Authors: P.K. Hung, Vo Van Hoang, T.D. Hanh, P.N. Nguyen
Keywords: Amorphous, Diffusion, Simulation
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Effects of Damaged Coarse Inclusion Particles on Mechanical Properties of Wrought Aluminum Alloys
Authors: Hiroyuki Toda, Akihiro Takahashi, Toshiro Kobayashi
Keywords: Al-Li Alloy, Damage, Fracture Mechanics, Fracture Toughness, Inclusions, Microcrack Shielding, Simulation, Thermomechanical Treatment, Wrought Aluminum Alloy
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Theoretical and Experimental on the Significant Creep Deformation of SUS 316 Induced by Irradiation at 60°C
Authors: J. Nagakawa, Y. Murase, N. Yamamoto, T. Fukuzawa
Keywords: In-Beam Experiment, Irradiation Creep, Irradiation Damage, Point Defects, Simulation
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The Ni Self-Diffusion in NiAl: An Experimental Investigation of the Temperature and Composition Dependencies and Atomistic Simulation of Diffusion Mechanisms
Authors: Sergiy V. Divinski, St. Frank, Christian Herzig, U. Södervall
Keywords: Diffusion Mechanism, NiAl, Point Defect Properties, Simulation, Tracer Diffusion
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Energy Order Effect of Aluminium Multiple Implantation in 6H-SiC
Authors: Laurent Ottaviani, Erwan Morvan, Marie-Laure Locatelli, Phillippe Godignon, Jean-Pierre Chante
Keywords: Energy Order, Multiple Ion Implantation, Recrystallization RX, Simulation
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Analysis of Aluminium Ion Implantation Damage into 6H-SiC Epilayers
Authors: Narcis Mestres, M. Ben El Mekki, F.J. Campos, Jordi Pascual, Erwan Morvan, Phillippe Godignon, José Millán, G. Lulli
Keywords: Ion Implantation, Raman, RBS, SIMS, Simulation
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Voltage Handling Capability and Microwave Performance of a 4H-SiC MESFET - A Simulation Study
Authors: V. Khemka, T.P. Chow, Ronald J. Gutmann
Keywords: MESFETs, Microwave Devices, Simulation
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Evaluating the Three Common SiC Polytypes for MESFET Applications
Authors: M. Roschke, F. Schwierz, G. Paasch, D. Schipanski
Keywords: MESFETs, SiC Polytypes, Simulation
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Grain Boundary Chemistry and Creep Resistance of Oxide Ceramics
Authors: Martin P. Harmer, H.M. Chan, J.M. Rickman, J. Cho, C.M. Wang
Keywords: Aluminium, Co-Doping, Creep, Grain Boundary Diffusion, Segregation, Simulation
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Application of Shear Lag Analysis to Tensile Behaviour of Fiber-Composites
Authors: Shouichi Ochiai
Keywords: Crack Propagation, Interactions, Interfacial Debonding, Shear Lag Analysis, Simulation, Unidirectional Fiber Composite
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