Papers by keyword «Texture» and «Copper (Cu)»
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The Effect of Annealing Texture on Orientation Correlations in Copper
Authors: O.V. Mishin
Keywords: Copper (Cu), Grain Boundary Misorientation Distribution, Orientation Correlation, Texture
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Determination of Σ3 Boundary Planes in Bulk Copper Samples with Different Textures
Authors: X. Huang
Keywords: Copper (Cu), Crystallographic Planes, Morphology, Ʃ3 Boundaries, Texture
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Texture Formation with Different Rolling Modes in Copper
Authors: Jan Pospiech, M. Wróbel, Jan T. Bonarski, M. Blicharski
Keywords: Copper (Cu), Microstructure, Rolling, Texture, Transverse Rolling
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The Influence of Substrate Texture on the Oxidation Kinetics of Copper
Authors: K.T. Lee, Hyo Tae Jeong, Jerzy A. Szpunar, Hong Gun Kim
Keywords: Copper (Cu), Oxidation, Texture
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Microstructure and Texture of Electrodeposited Cu on TiN Thin Films without a Cu Seed Layer
Authors: Ingi Kim, Insoo Kim, Sang-Chul Hong, Do Heyoung Kim
Keywords: Copper (Cu), Diffusion Barriers, Interconnection, Morphology, Palladium Chloride, Texture, Titanium Nitride TiN, Without Cu Seed Layer
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The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits
Authors: Jae Young Cho, Jerzy A. Szpunar
Keywords: Atomic Force Microscopy (AFM), Copper (Cu), Electroplating, Microstructure, Morphology, Orientation Image Microscopy (OIM), Texture, X-Ray
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Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling
Authors: Soo Jung Hwang, Hyun Park, Je Hun Lee, Kyu Hwan Oh, Young Chang Joo
Keywords: Copper (Cu), Electroplating, Sputtering, Stress Voiding, Texture, Thin Film
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Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI
Authors: Hyo Jong Lee, Dong Nyung Lee
Keywords: Copper (Cu), Pulse Plating, Surface Morphology, Texture, ULSI
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X-Ray Diffraction Investigation of Electrochemically Deposited Copper
Authors: Karen Pantleon, Jens Dahl Jensen, Marcel A.J. Somers
Keywords: Copper (Cu), Electrodeposition, Texture, Thin Film, X-Ray Diffraction (XRD)
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Texture of Electroplated Coatings of Copper and Bismuth Telluride
Authors: H. Chaouni, P. Magri, J. Bessières, C. Boulanger, J.J. Heizmann
Keywords: Bismuth Telluride, Copper (Cu), Electrodeposition, Pole Figure, Texture
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