Papers by keyword «Texture» and «Nickel Ni»
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The Role of Oxide Grain Boundary Character Distribution in Nickel Oxidation Kinetics
Authors: Hua Long Li, Frank Czerwinski, Jerzy A. Szpunar
Keywords: Diffusion, Grain Boundary, Nickel Ni, Oxidation Kinetics, Simulation, Texture
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Analysis of Compression Textures of Aluminum and Nickel Rods
Authors: Kyung Keun Um, Hyo Tae Jeong, Sung Bo Lee, Dong Nyung Lee
Keywords: Aluminium, Annealing, Axisymmetrical, Compression, Nickel Ni, Texture
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Textural and Microstructural Characterization of Equal Channel Angular Pressed Nickel
Authors: Werner Skrotzki, R. Tamm, R. Klemm, E. Thiele, C. Holste, H. Baum
Keywords: Equal Channel Angular Pressing (ECAP), Microstructure, Nickel Ni, Texture
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Orientation Distribution in Dynamically Recrystallized Nickel
Authors: Hiroshi Fukutomi, Makoto Hasegawa, Kazuto Okayasu
Keywords: Dynamic Recrystallization (DRX), EBSP Measurement, Grain Boundary Analysis, Nickel Ni, Texture, Twin
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Plastic Strain Ratios of Fe and Ni Electrodeposits
Authors: Hyung Joon Shin, Dong Nyung Lee
Keywords: Crystal Plasticity, Electrodeposits, Finite Element Method (FEM), Iron, Nickel Ni, Plastic Anisotropy, R-Value, Texture
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Effects of Textures on Hydrogen Diffusion in Nickel
Authors: Yang Cao, Hua Long Li, Jerzy A. Szpunar, W.T. Shmayda
Keywords: Absorption Energy, Hydrogen Permeation, Nickel Ni, Texture
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Texture and Phase Development in Al-40at% Ni Composites
Authors: H. Gertel-Kloos, Heinz Günter Brokmeier
Keywords: Aluminium, Composite, Intermetallic Phases, Neutron Diffraction, Nickel Ni, Texture
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Correlation between Texture and Dislocation Structure in Deformed Metals
Authors: V.N. Dnieprenko
Keywords: Al, Cu, Cu-Al Alloys, Dislocation Substructure, Nickel Ni, Subgrains, Texture
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Textural and Microstructural Evolution during Cold-Rolling of Pure Nickel
Authors: Niels Hansen, Dorte Juul Jensen, D.A. Hughes
Keywords: Cell Blocks, Cold-Rolling, Deformation Pattern, Geometrically Necessary Boundaries, Microstructure, Nickel Ni, Texture
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Annealing Textures of Thin Films and Copper Interconnects
Authors: Dong Nyung Lee
Keywords: Abnormal Grain Growth, Aluminium, Annealing, Chromium, Copper (Cu), Copper Interconnect, Fe-Ni Alloys, Nickel Ni, Ni-Co-P Alloys, Recrystallization, Silver, Texture, Thin Film
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