Papers by keyword «Texture» and «Thin Film»
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Texture Evolution in Stratified Al Thin Films
Authors: M. Adamik, I. Tomov, P.B. Barna
Keywords: Morphology, Texture, Thin Film
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Influence of Oxygen on the Development of Texture and Grain Morphology in Polycrystalline Al Thin Films
Authors: M. Adamik, P.B. Barna, I. Tomov
Keywords: Impurity, Morphology, Texture, Thin Film
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The Influence of Texture and Grain Boundary Character Distribution on the Reliability of Aluminium Thin Films
Authors: K.T. Lee, Jerzy A. Szpunar, D.B. Knorr
Keywords: Grain Boundary Character Distribution, Reliability, Texture, Thin Film
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Rietveld Texture and Stress Analysis of Thin Films by X-Ray Diffraction
Authors: Luca Lutterotti, Siegfried Matthies, Daniel Chateigner, Sandro Ferrari, Jesús Ricote
Keywords: Diffraction, Residual Stress, Rietveld, Texture, Thin Film
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Texture Evolution of Cu Thin Films during Annealing
Authors: Maria Teresa Pérez-Prado, J.J. Vlassak
Keywords: Multiple Twinning, Texture, Thin Film
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Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling
Authors: Soo Jung Hwang, Hyun Park, Je Hun Lee, Kyu Hwan Oh, Young Chang Joo
Keywords: Copper (Cu), Electroplating, Sputtering, Stress Voiding, Texture, Thin Film
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Effect of Texture and Structure of Carbon Sources on Synthesis of β-SiC Thin Film
Authors: Yasuo Uchiyama, Naoki Urase, Takehiro Higuchi, Hideaki Sano
Keywords: Carbon Source, Gaseous Silicon Monoxide, Structure, Texture, Thin Film, β-Silicon Carbide
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Fitting of Reciprocal Space Maps of Thin Films with Texture and Stress
Authors: D. Šimek, Radomír Kužel, J. Kub, F. Kunc
Keywords: Macroscopic Stress, Reciprocal Space Map Fitting, Texture, Thin Film
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X-Ray Diffraction Investigation of Electrochemically Deposited Copper
Authors: Karen Pantleon, Jens Dahl Jensen, Marcel A.J. Somers
Keywords: Copper (Cu), Electrodeposition, Texture, Thin Film, X-Ray Diffraction (XRD)
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Annealing Textures of Thin Films and Copper Interconnects
Authors: Dong Nyung Lee
Keywords: Abnormal Grain Growth, Aluminium, Annealing, Chromium, Copper (Cu), Copper Interconnect, Fe-Ni Alloys, Nickel Ni, Ni-Co-P Alloys, Recrystallization, Silver, Texture, Thin Film
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