Papers by keyword «Thin Film» and «Copper (Cu)»
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Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B'
Authors: N. Balandina, Boris Bokstein, A. Ostrovsky
Keywords: Copper (Cu), Diffusion, Grain Boundary, Nickel Ni, Secondary-Ion Mass Spectrometry, Stress, Thin Film
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Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling
Authors: Soo Jung Hwang, Hyun Park, Je Hun Lee, Kyu Hwan Oh, Young Chang Joo
Keywords: Copper (Cu), Electroplating, Sputtering, Stress Voiding, Texture, Thin Film
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The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films
Authors: Young Chang Joo, Soo Jung Hwang, Hyun Park
Keywords: Copper (Cu), Diffusion, Electroplating, Microstructure, Sputtering, Stress Voiding, Thin Film
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X-Ray Diffraction Investigation of Electrochemically Deposited Copper
Authors: Karen Pantleon, Jens Dahl Jensen, Marcel A.J. Somers
Keywords: Copper (Cu), Electrodeposition, Texture, Thin Film, X-Ray Diffraction (XRD)
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Annealing Textures of Thin Films and Copper Interconnects
Authors: Dong Nyung Lee
Keywords: Abnormal Grain Growth, Aluminium, Annealing, Chromium, Copper (Cu), Copper Interconnect, Fe-Ni Alloys, Nickel Ni, Ni-Co-P Alloys, Recrystallization, Silver, Texture, Thin Film
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Texture Evolution in Thin Cu Films and Lines
Authors: David P. Field, John E. Sanchez, No Jin Park, Paul R. Besser
Keywords: Copper (Cu), Electron Backscattered Diffraction (EBSD), Grain Growth, Thin Film
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Quantitative Texture Analysis of Electrodeposited Line Patterns
Authors: Karen Pantleon, Marcel A.J. Somers
Keywords: Copper (Cu), Electroplating, Epitaxy, Nickel Ni, Texture, Thin Film, X-Ray Diffraction (XRD)
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