Papers by keyword «Thin Film» and «Electron Backscattered Diffraction (EBSD)»
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Crystal Texture and Electromigration Damage in Al-Based Interconnect Lines Studied by ACOM with the SEM
Authors: M. Lepper, A. von Glasow, D. Piscevic, Robert A. Schwarzer
Keywords: ACOM, Aggregate Function, Aluminium, BKD, Electromigration, Electron Backscattered Diffraction (EBSD), Thin Film
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Texture Evolution in Thin Cu Films and Lines
Authors: David P. Field, John E. Sanchez, No Jin Park, Paul R. Besser
Keywords: Copper (Cu), Electron Backscattered Diffraction (EBSD), Grain Growth, Thin Film
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