Papers by Author: Anders Hallén

Abstract: In this paper, the temperature dependence of charge carrier lifetimes in n-type 4H-SiC epitaxial layers is studied in a temperature range of 300-500 K. It is assumed that shallow (B) and deep (D) boron-related defects are the dominating lifetime killers in as-grown epitaxial layers. The thermodynamic behavior of these two types of defects is obtained from DLTS measurements, and implemented in the Shockley-Read-Hall (SRH) model to calculate lifetimes, using Gibbs free energies to describe the accurate temperature dependence for capture and emission processes of the defects. Calculation results show that the lifetimes controlled by shallow boron defects increase with increasing temperature, while D-defects give the opposite temperature dependence. The theoretical results are also compared to measured data from 10 kV 4H-SiC PiN-structures, showing that the temperature dependence of the effective lifetime can be changed by proton implantations, which gives rise to additional Z_1/2 defects that have similar temperature effects on lifetimes as D-related defects.

Abstract: In this work, MeV alpha particles generated from an accelerator are used to study single event breakdown (SEB) in 4H-SiC MOSFET samples, rated at 3.3 kV. The samples are exposed to bursts of alpha particles under reverse bias conditions to investigate the SEB sensitivity to ion energy and reverse bias. The energies of alpha particles are chosen to reach different depths in the drift region of the MOSFET devices, and also to penetrate the whole drift region. Forward and reverse characteristics are measured after each exposure, as long as no failures occur, to ensure that the device performance is maintained. The measurements show that no significant effects are observed on the drain-source leakage current, while minor effects on gate behavior can be seen as a function of accumulated fluence. Furthermore, SEB can only be triggered with a reverse bias larger than, or equal to 3 kV. A standard MOSFET cell with a similar rated voltage is also simulated in Sentaurus TCAD to study these effects, using two different models for the incident ion-induced ionization: the Alpha Particle and the Heavy Ion model. Simulations show that the Alpha Particle model cannot induce any device failures even with a 3.5 kV reverse bias, while it is possible to trigger a failure by the Heavy Ion model, where the ionization can be selected. Carrier plasma and internal electric field distributions of the two models are plotted and compared, showing that device failures triggered by a heavy ion are related to the hole injection at epi-substrate interface, in which linear energy transfer (LET) of the particle plays an important role.

Abstract: In this study, we introduce the impact of gamma irradiation on 4H-SiC based transistor-transistor logic (TTL) inverters. These monolithic bipolar inverters have been successfully demonstrated in a broad spectrum of temperature and supply voltage conditions. In this iteration of experiments, attempts made to the processing to increase beta values. The gamma radiation tests from a ⁶⁰Co source were conducted under various operation conditions and measured in-situ under different biasing conditions. The Silicon Carbide Integrated circuits ( SiC ICs) show excellent tolerance properties to gamma radiation up to doses of nearly 1 MRad. Comparable Si BJT-based TTL inverters show considerable degradation already at one order of magnitude lower doses, clearly demonstrating the superior radiation hardness of 4H-SiC ICs.

Abstract: The knowledge of capture properties of electrically active defects is of primary importance as it helps to understand which deep states are effective in controlling the excess free carriers’ lifetime. Combining DLTS capture experiments with thermal emission measurements enables an overall thermodynamic description of deep states, thus making it possible to characterize recombination centers in semiconductor-based devices. In the present study, junction DLTS capture rate measurements were employed to extract the true capture cross-sections (inversely proportional to the carrier lifetime) and capture energy barriers for the main lifetime limiting defects in 4H-SiC (silicon carbide). A peculiar forward bias dependence of the capture parameters was observed for the shallow boron (B) hole trap. Capture rate measurements on the deep boron (D-center) trap also evidenced the presence of two capture mechanisms, thus allowing discrimination of D₁ and D₂ deep states within the D-center DLTS peak. The results were combined with activation energies and apparent capture cross-sections to obtain the free energy (ΔG) of electronic activation for the analysed deep states.

Abstract: In all implantations into crystalline targets, quite a few ions find a path along a crystal channel or plane, so called channeling, and these ions travel deep into the crystal. This paper treats aluminum (Al) implantation in 4H-SiC and show how the crystal lattice will guide incoming ions deep into the target and modify the final dopant distribution. 4H-SiC samples have been implanted with 100 keV Al-ions, in a “random” direction using the wafer miscut angle of 4°, as well as with the impact beam aligned anti-parallel to the [0001] direction. Aluminium concentration versus depth profiles has been recorded by secondary ion mass spectrometry (SIMS). To track the most probable ion paths during stopping process, SIIMPL, a Monte Carlo simulation code based on the binary collision approximation (MC-BCA) has been used. In addition, the remaining ion energy has been extracted from SIIMPL at various depth along the ion path. Our results show that, independent of the used impact angle, some ions will be steered by crystal planes predominantly into the direction and also along the six directions. The energy loss is smaller along these low index axes. Therefore, at a depth of 1.2 μm, some Al ions along a path may still have kinetic energy, more than 40% of the original 100 keV, and continues to move deep into the SiC sample. The mean projected range of 100 keV ions in 4H-SiC is about 120 nm.

Abstract: In this paper, Shockley-Read-Hall (SRH) lifetime depth profiles in the drift layer of 10 kV SiC PiN diodes are calculated after MeV proton implantation. It is assumed that the carbon vacancy will be the domination trap for charge carrier recombination and the SRH lifetime is calculated with defect parameters from the literature and proton-induced defect distributions deduced from SRIM calculations. The lifetime profiles are imported to Sentaurus TCAD and static and dynamic simulations using tailored lifetime profiles are carried out to study the electrical effect of proton implantation parameters. The results are compared to measurements, specializing on optimization of the trade off between on-state and turn-off losses, represented by the forward voltage drop, V_T, and reverse recovery charge, Q_rr, respectively. Both the simulated and measured IV characteristics show that increasing proton dose, or energy, has the effect on increasing forward voltage drop and on-state losses, while simultaneously, the localized SRH lifetime drop decreases the plasma level, increases the speed of recombination and decreases reverse recovery charge. Finally, TCAD simulations with different combinations of proton energies and fluences are used to optimize the trade-off between static and dynamic performances. Reverse recovery charge and forward voltage drops of these groups of diodes are plotted together, showing that a medium energy which induces the most defects in the depletion region relatively close to the anode gives the best dynamic performances, with a minimum cost of static performance.

Abstract: In this paper, proton implantation with different combinations of MeV energies and doses from 2×10⁹ to 1×10¹¹ cm^-2 is used to create defects in the drift region of 10 kV 4H-SiC PiN diodes to obtain a localized drop in the SRH lifetime. On-state and reverse recovery behaviors are measured to observe how MeV proton implantation influences these devices and values of reverse recovery charge Q_rr are extracted. These measurements are carried out under different temperatures, showing that the reverse recovery behavior is sensitive to temperature due to the activation of incompletely ionized p-type acceptors. The results also show that increasing proton implantation energies and fluencies can have a strong effect on diodes and cause lower Q_rr and switching losses, but also higher on-state voltage drop and forward conduction losses. The trade-off between static and dynamic performance is evaluated using Q_rr and forward voltage drop. Higher fluencies, or energies, help to improve the turn-off performance, but at a cost of the static performance.

Abstract: In this paper, a technology computer-aided design (TCAD) model of a silicon carbide (SiC) insulated-gate bipolar transistor (IGBT) has been calibrated against previously reported experimental data. The calibrated TCAD model has been used to predict the static performance of theoretical SiC IGBTs with ultra-high blocking voltage capabilities in the range of 20-50 kV. The simulation results of transfer characteristics, I_C-V_GE, forward characteristics, I_C-V_CE, and blocking voltage characteristics are studied. The threshold voltage is approximately 5 V, and the forward voltage drop is ranging from V_F = 4.2-10.0 V at I_C = 20 A, using a charge carrier lifetime of τ_A = 20 μs. Furthermore, the forward voltage drop impact for different process dependent parameters (i.e., carrier lifetimes, mobility/scattering and trap related defects) and junction temperature are investigated in a parametric sensitivity analysis. The wide-range simulation results may be used as an input to facilitate high power converter design and evaluation. In this case, the TCAD simulated static characteristics of SiC IGBTs is compared to silicon (Si) IGBTs in a modular multilevel converter in a general high-power application. The results indicate several benefits and lower conduction energy losses using ultra-high voltage SiC IGBTs compared to Si IGBTs.

Abstract: Channeling phenomena during ion implantation have been studied for 50 keV ¹¹B, 100 keV ²⁷Al and 240 keV ⁷¹Ga in 4H-SiC by secondary ion mass spectrometry and medium energy ion backscattering. The same projected range are expected for the used energies while the channeling tails are shown to be substantially different, for example, channeled ⁷¹Ga ions may travel 5 times as deep as ¹¹B. Ion implantation has been performed both at room temperature (RT) and 400 °C, where channeling effects are reduced for the 400 °C implantation compared to that of the RT due to thermal vibrations of lattice atoms. The temperature effect is pronounced for ⁷¹Ga but nearly negligible for ¹¹B at the used energies. The channeling phenomena are explained by three-dimensional Monte Carlo simulations. For standard implantations, i.e. 4° off the c-direction, it is found that a direction in-between the [000-1] and the <11-2-3> crystal channels, results in deep channeling tails where the implanted ions follow the [000-1] and the <11-2-3> directions.

Abstract: Channeling of B and Al ions in 4H-SiC(0001), has been investigated by secondary ion mass spectrometry (SIMS). Ion implantations have been performed between room temperature (RT) and 600 °C at various fluences. Before implantation, the major crystal axes were determined and the sample was aligned using the blocking pattern of backscattered protons. As expected, the depth distribution of the implanted ions along a crystal direction penetrates much deeper compared to non-channeling directions. At elevated temperatures, the channeling depth for 100 keV Al-ions is decreased due to lattice vibrations. For 50 keV B-ions, the temperature effect is minor, indicating a smaller interaction between target atoms and B. Simulations has been performed using SIIMPL, a Monte Carlo simulation code based on the binary collision approximation, to predict experimental data and get a deeper insight in the channeling process.