Papers by Author: Dong Ming Guo

Abstract: Carbon fiber/epoxy resin composites (C/E composites) are wildly used in manufacture of aircraft fuselages and wings in aerospace industry, due to their excellent properties. However, hole making of C/E composites always results in machining damage, such as burr, tearing, delamination and so on. Milling tools with different shapes were used to conduct helical milling experiments on C/E composites. The influence of tool shape on machining damage was analyzed by measuring the damage area of burr, tearing and delamination. And then the feed speed, axial feed per orbital revolution and spindle speed was changed respectively to study the effect of processing parameters on machining damage. The machining damage can be reduced by choosing appropriate tool shape and processing parameters.

Abstract: Accurate prediction of the material removal rate (MRR) distribution is very important for the control of the polishing process. However, the widely used prediction method of MRR based on the Preston equation is still incapable of predicting the roll-off phenomenon in polishing process. One of the reasons is that many of the researchers’ neglected the effect of the surface profile of the workpiece on the MRR. In this paper, the evolutionary process of MRR distribution with the change of surface profile using two different polishing pad is studied, it is found that MRR varies gradually with the change of surface profile and tends to be uniform finally. Based on the analysis of contact pressure considering the actual surface profile of workpiece and modified Preston equation, the distribution of MRR is analyzed. It is found that the Preston coefficient distribution on workpiece surface is stable when the surface profile variation is small and shows obvious differences from the center to the edge of the workpiece. Through the comparison it is found that correlation between the regularities of Preston coefficient distribution and the type of polishing pad is significant. The research results in this paper will play an important guiding role in the quantitative prediction method research of polishing process.

Abstract: Ultra-precision grinding is widely used in machining of the hard and brittle materials due to its high surface accuracy and machining efficiency. However, grinding inevitably brings about surface and subsurface damage that needs to be removed by the polishing processes. This study investigated the surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding. The characteristics of surface roughness, surface topography and subsurface damage depth of ground glass-ceramics with diamond grinding wheels with different grain sizes were presented and compared. Discussion was also provided to explore corresponding reasons of surface and subsurface integrity induced by diamond grinding wheels with different grain sizes.

Abstract: This paper presents the results of an experimental investigation on molar ratios of MgO/ MgCl₂ affecting the hardness of magnesia grinding wheels, which is one of the most important properties. Magnesite grinding blocks of different ratios of MgO/MgCl₂ were prepared. The surface Rockwell hardness of which was tested under the same curing conditions. By an integrated assessment of the experimental studies of hardness and component, it is recognized that the molar ratios of MgO/MgCl₂ can significantly affect the properties of magnesia grinding wheels. With the increase of MgO/MgCl₂ molar ratio, hardness of the specimens increases. Scanning electron microscopy (SEM) studies on grinding blocks of different ratios indicated that micro needle shaped crystal structure of phase 5 are mainly responsible for hardness development. Finally the optimal recipe was selected in consideration of the characteristics of the silicon mechanical chemical grinding (MCG), which was verified to be effective by the following grinding experiment.

Abstract: Wire saw process is widely used in the machining of hard and brittle materials with low surface damage and high efficiency. Cutting of silicon wafers in integrated circuit (IC), semiconductor and photovoltaic solar industries is also generally using wire saw process. However, the surface layer damage induced by wire saw process will seriously decrease the wafer quality and increase the process time and production costs of the post grinding and polishing. The surface layer qualities of the silicon wafers sawed by the different wire saw processes was investigated in this paper. The characteristics of surface roughness, surface topography and subsurface damage of silicon wafers sliced by the fixed abrasive and the loose abrasive wire sawing respectively were compared and the corresponding reasons were analyzed.

Abstract: Larger diameter wafers are used to decrease the cost of IC manufacturing and the wafer thickness is decreasing for form factor and thermal power dissipation considerations. The larger wafer requires a large scanning area to inspect the warp, and warp measurement of large and thin silicon wafers is greatly affected by the gravity-induced deflection. In this paper the gravity-induced deflection was calculated using finite element method by supporting the wafer horizontally with three steel balls. A laser displacement sensor based on triangulation principle was used to measure the warp and an air bearing stage was developed to achieve high straightness. The shape of the wafer was obtained using the silicon wafer warp measuring equipment.

Abstract: The hydrostatic seal rings are one of the most important components used in reactor coolant pumps. They are generally made of hard materials such as silicon nitride, alumina, silicon carbide and tungsten carbide. Meanwhile, the form error should be within the length of one to two helium light bands and the surface roughness should be in the scale of nanometers, which make them difficult to machining. In order to solve this problem, a high accuracy grinding method using a large cup wheel had been proposed and the tilt angle of the cup wheel spindle become a crucial factor affecting the ground form errors. This paper addresses a novel method for high-accuracy calibrating the tilt angle of the cup wheel spindle to fit the extremely shallow taper angle of the seal ring conical surface, and the mathematical model is established incorporating a standard optical flat with a high-accuracy laser displacement sensor. The practicability of this method is verified by grinding a seal ring sample with the outer diameter is 200 mm and the taper angle is 700 μrad. It is found that the taper angle error is only 1.72 μrad and the radical profile error of the conical surface is about 0.22 μm.

Abstract: KDP crystal (Potassium dihydrogen phosphate single crystal) is extremely difficult to obtain flawless surface because of its soft, brittle, and hygroscopic. And a large amount of time has been spend on obtaining flawless surface with ultra-precision machining methods. In order to quickly reduce surface roughness on KDP crystal, a new micro-deliquescence polishing method with fine water mist was proposed, the polishing tool with fine water mist was designed, and the polishing experiment was carried out. The micro-deliquescence polishing with fine water mist can improve the surface quality of KDP crystal quickly, so it is an effective preprocessing before ultra-precision machining.

Abstract: The design ideas of intelligent control and the influence mechanism of process parameters on chemical mechanical polishing (CMP) are combined to develop the CMP intelligent monitoring system, which has the function of learning, inference and memory. The system can be used in many kinds of CMP facilities, the process parameter from the system can be used to control each unit of the CMP facility. And compared with the past way of processing by virtue of experience, the system has friendly operating interface and is easy to operate. The volume production of silicon wafers can be achieved by the total CMP intelligent monitoring. The efficiency of production can be improved highly on condition that the quality can be ensured.

Abstract: In order to improve the surface quality of sapphire substrates ground by diamond wheel, the chemo-mechanical grinding (CMG) tools for sapphire grinding was investigated in this paper. According to the processing principle of CMG, three CMG tools with different abrasives of SiO2, Fe2O3 and MgO were developed respectively. The compositions of the CMG tools were designed and optimized based on the physicochemical characteristics of sapphire. The grinding experiments were performed with the developed CMG tools and the grinding performance of three kind of tools were evaluated by comparing the surface roughness and the MRR of sapphire. The experiment results show that the grinding performance of SiO2 CMG tool was worst. The surface roughness and MRR corresponding to SiO2 CMG tool were all significantly poorer than Fe2O3 and MgO CMG tools. The highest MRR could be obtained by Fe2O3 CMG tool, but the best surface quality was obtained by MgO CMG tool.