Papers by Author: Eiji Osawa

Abstract: Due to their interesting properties copper-based materials have been considered appropriate heat-sinks for first wall panels in nuclear fusion devices. The concept of property tailoring involved in the design of metal matrix composites has led to several attempts to use nanodiamond (nDiamond) as reinforcement. In particular, nDiamond produced by detonation has been used to reinforce copper. In the present study, powder mixtures of copper and nDiamond with 20 at. % C were mechanically alloyed (MA) and consolidated via hot extrusion or spark plasma sintering (SPS). The hardness evolutions as well as the structural characterization of as-milled nanocomposite powders and consolidated samples are reported. Density measurements indicate that the consolidation outcome varies significantly with the process used. Transmission electron microscopy (TEM) inspection of the extrusion consolidated sample revealed bonding at the interface between copper and nDiamond particles. The nDiamond size distribution was determined from TEM observations. The results obtained are discussed in terms of consolidation routes.

Abstract: Now that nano diamonds can be produced stably at low costs, there are growing needs to explore new areas of applications. This report discusses basic polishing experiments performed on nano diamonds to investigate their frictional and wear characteristics during polishing, and the results been obtained. The authors also propose a new terminology “tribo-fabrication” to mean an area of research on tribological phenomena seen with the interface of workpiece and tool surface in ultra-precision fabrication. These new term as well as the polishing characteristics of nano diamond are discussed.

Abstract: Copper has widespread use as engineering material, because of its structural and functional properties, notably high thermal and electrical conductivity. A major drawback of this base metal and its alloys is a relatively low hardness. This precludes its utilization in applications in which both high conductivity and high strength/hardness are needed, e.g. in injection moulds for plastics. Nanostructured metals and nanocomposites are ways to address the low hardness problem, provided the nanostructured material is thermally stable during processing and service. In the present research, composite powders, with 5 to 30 at % nanodiamond, were consolidated into bulk samples. The copper-nanodiamond composite powders were vacuum encapsulated and extruded at 600°C. A significant proportion of the initial hardness in the powders is retained after extrusion. Transmission electron microscopy (TEM) of the extruded material indicates good bonding between the nanodiamond particles and the copper matrix. Raman spectroscopy on the consolidated samples evidences the presence of graphite, possibly due to partial disintegration of ultradisperse nanodiamond agglomerates.