Papers by Author: Francesco La Via

Abstract: This work discusses the use of gallium nitride (GaN)-based solid-state devices for high-power, high-frequency, and high-temperature technology. The article presents the results of an investigation into the Al fraction of AlGaN as a function of GaN cap growth time through µ-Raman and µ-Photoluminescence (µ-PL) spectroscopy under λ=325 and 266 nm laser source. The data exhibit that the detected Al fraction decreases as the GaN cap layer size increases, consistently with the surface quantum well effect in the layer stack. The study confirms that the GaN cap layer is acting as a potential well and enables the design of a non-destructive and quantitative assessment of the grown thickness of the GaN cap layer through UV laser spectroscopy. The interpretation of the data also rules out the possibility of thermal migration of Al in the adjacent GaN layers during MOCVD growth.

Abstract: In this work, we investigated the impact of crystallographic defects (specifically stacking faults, SFs) on the mechanisms of the current transport in 4H-SiC Schottky contacts. The electrical characteristics were studied under both forward and reverse bias. In particular, while the presence of SFs under the contact did not show a significant impact on the forward characteristics of the Schottky diode, a significant increase in the leakage current occurred under reverse bias in defective diodes. This anomalous behavior can be explained by a space-charge limited current model, consistent with the presence of a trapping state distribution in the 4H-SiC gap. An increase of the reverse bias above 30 V leads to a complete trap filling. The weak temperature-dependence of the leakage current observed at highest voltage suggests that a tunneling of the carriers through the barrier can be also present.

Abstract: Solid State Detectors (SSD) are crucial for fast neutron detection and spectroscopy in tokamaks due to their solid structure, neutron-gamma discrimination, and magnetic field resistance. They provide high energy resolutions without external conversion stages, enabling compact array installations in the harsh environment of a tokamak. Research comparing diamond and 4H-SiC detectors highlights thickness as a key efficiency factor. A 250 μm SiC epilayer with low doping, grown using a high-growth-rate process, exhibits sharp interfaces and minimal defects, essential for neutron detectors. The study evaluates detector designs, and performance using a 4H-SiC substrate. Various detector designs, such as Schottky diodes and p/n diodes, are assessed via I-V and C-V measurements, addressing high depletion voltage challenges. Preliminary neutron irradiation tests validate detector functionality, energy resolution and confirming detector reliability.

Abstract: In this paper the stress field distribution in 3C-SiC (111) resonators has been studied by micro-Raman measurements and COMSOL simulations. The measurements show that the asymmetry of the anchor points configuration produce an asymmetry in the stress filed distribution. This behavior has been confirmed also by the simulations. Furthermore, from the simulations the importance of the reduction of the under etching of the anchor points of the resonators has also been observed. In fact the reduction of this under etch produces a decrease of the stress in the double clamped beams, a small reduction of the resonance frequency, and a large reduction of the Q-factor and then of the oscillation frequency stability of the resonators in closed-loop operation.

Abstract: In this work, the fabrication of wafer-level vacuum packaged 3C-SiC resonators obtained from layers grown on <100> and <111> silicon is reported. The resonant microstructures are double-clamped beams encapsulated by glass-silicon anodic bonding using titanium-based vacuum gettering. Open-loop resonance frequency measurements are performed on the vacuum-packaged devices showing Q-factor values up to 292,000 for <100> and 331,000 for <111> substrates, with a maximum vacuum level around 10^-2 mbar inside the encapsulations with Ti getter.

Abstract: Within this work, the effect of high dose Al ion implantation on 4H-SiC epitaxial layer is displayed. Through TEM investigation it is demonstrated that the implanted surface is suitable as seed for subsequent epitaxial regrowth generating a crystal free of extended defects. In order to assess the defects within the projected range of the ion implanted area, High Angle Annular Dark Field STEM (HAADF-STEM) analyses were performed demonstrating the atomic arrangement of the lattice in correspondence of the dislocation loop and the deviation of the crystallographic planes of 4H-SiC, driven by stress relaxation, that determine the staircase configuration of the implant pattern. Further emphasis is given to the detailed analysis of the precipitates atomic structure, whose preferential localization is ascertained. Using Energy-Dispersive X-ray spectroscopy (EDS) analysis, the precipitate is finally established as Al crystal with an FCC structure.

Abstract: In this work we have studied hydrogen etching of Silicon Carbide (SiC) chips at high temperatures and in confined limited regions, to elucidate and control the formation and propagation of terraces on the surface of SiC (0001) 4° off-axis samples. This process is very important for the development of high-power transistors. The effects of process parameters on the etching of 4H-SiC (0001) have been extensively investigated using several types of surface analysis (Atomic Force Microscopies (AFM), Scanning Electron Microscope (SEM) and High-angle annular dark-field scanning transmission electron microscopy (HAADF-STEM). We correlated the growth of terraces with etching temperature and time. Moreover, we found the average width of terraces increases decreasing the dimension of the structure from 20 µm to 1 µm using the same process parameters. The nanofacet formation of typical hill-and-valley structure has been observed in localized region on SiC (0001) basal plane.

Abstract: Free standing wafers of the cubic polytype of silicon carbide (3C-SiC) grown on micromachined silicon substrates can be a platform for new power electronic devices, provided that suitable device fabrication processes are understood and optimized. In this frame, p-type doping is still an open issue, as results on the electrical activation of ion implanted Al in 3C-SiC are limited. This work analyses high level p-type doping with post-implantation annealing carried out at temperatures in the range 1650-1850 °C with different durations. A coherent picture emerges, showing that the resulting resistivity in 3C-SiC Al-implanted layers is higher than the one obtained in 4H-SiC implanted layers, the result being ascribed to low carrier mobility and possibly presence of compensation centers, rather than to poor Al electrical activation. The reported results highlight the importance of working on material and processing optimization.

Abstract: X-Ray diffraction measurements of lattice parameter were performed for (111) and (100) oriented 3C-SiC/Si epiwafers. Strain of 3C-SiC epilayer and Si substrate were estimated and the result was compared with routine wafer deformation measurements. An unexpected discrepancy was observed between XRD and curvature measurements for (100) oriented samples.

Abstract: In this work, we investigate the correlation between tensile residual stress and Q-factor of double-clamped beams fabricated on epitaxial 3C-SiC layers grown on both <100> and <111> silicon substrates, using a completely optical measurement setup to measure the Q-factor of the resonators and the residual stress of the layers by means of purposely designed micromachined test structures. From the measurements, a clear correlation appears between the residual stress of the SiC layer and the Q-factor of the resonators, with Q-factor values above half a million for resonators fabricated on <111> substrates, showing residual stress around 1 GPa.