Papers by Author: Heiko B. Weber

Abstract: We studied the impact of ion implantation into the wafer substrate prior to the epitaxy process on the basal plane dislocation conversion behavior during epitaxial layer growth. Defect density measurements show an enhancing effect of the ion implantation on the basal plane dislocation to threading edge dislocation conversion. Analysis of the lateral conversion distribution, the stress field in the material as well as the wafer topography at the onset of epitaxial growth lead us to believe, that stresses in the epitaxy layer cause the enhanced basal plane dislocation conversion.

Abstract: Current-voltage characterization and thermal dielectric relaxation current (TDRC) measurements are carried out on 4H silicon carbide (SiC) n-channel MOSFETs processed with different post oxidation anneals (POAs) in O₂, N₂O, and NO atmospheres at high temperature. In all samples we observe a distinct peak at a temperature of 70 K in the TDRC spectra due to a defect close to the conduction band of 4H-SiC having a high density of states (>10¹³ cm^-2eV^-1). We show that this defect is related to the degradation of the device performance such as the MOSFET conductivity. Comparing the different POAs, NO strongly reduces the density of states close to the conduction band and thus increases the amount of free channel electrons. Based on TDRC measurements we want to suggest a method for more accurate estimation of the true channel mobility accounting for the reduced channel electron density due to trapping.

Abstract: We have performed capacitance-voltage (C-V) and deep level transient spectroscopy (DLTS) measurements on Schottky contacts fabricated on triangular defects in 4H-SiC epitaxial layers. These measurements are a case study on the effect of a specific extended defect on the DLTS spectrum in order to contribute to the physical understanding of curious features occasionally observed in DLTS spectra. Our measurements reveal an inversion of the DLTS signal depending on applied voltages and filling pulse lengths, and a step in the C-V characteristic of the Schottky diode. We present a model that qualitatively describes the experimentally obtained data. In this model, we assume that stacking faults within a triangular defect form quantum wells, which can capture electrons from other defects during the DLTS measurement leading to the inversion of the DLTS spectrum. Moreover, by calculating the differential capacitance using a self-consistent Schrödinger-Poisson-Solver, the step in the C-V measurements is reproduced by our model.

Abstract: Drain current DLTS (I_D-DLTS) and Hall effect measurements were carried out on two types of 4H-SiC n-MOSFETs, one with a post oxidation annealing (POA) in NO and one in O₂ atmosphere. Hall effect measurements show a reduction of D_it by POA in NO compared to POA in O₂ and, as a consequence, a higher inversion charge carrier density, while the Hall mobility is only weakly affected by the introduction of nitrogen during POA. Based on I_D-DLTS we provide a method for a quantitative and selective investigation of near interface traps (NITs) in the oxide. It is shown that POA in NO strongly reduces the density of NITs.

Abstract: Germanium (Ge) doping of 4H silicon carbide (SiC) has recently attracted attention because a conductivity-enhancing effect was reported. In this work, we report on an experimental and theoretical approach to elucidate this effect. Ge and tin (Sn) – a second candidate of group IV elements – have been implanted into n-type 4H-SiC. Despite the expected isoelectric nature of Ge and Sn, a more efficient annealing of implantation-induced defects was observed compared to noble gas implantation with identical simulated initial implantation damage. In particular, a strong reduction of the prominent Z_1/2 defect was observed. Density functional theory calculations under equilibrium conditions show that Ge is mainly incorporated on a substitutional silicon lattice site without creating new charge transition levels in the bandgap. The low abundance of other Ge-related defects suggests that kinetic mechanisms should be responsible for the observed effect of group IV doping.

Abstract: In this work the effect of phosphorus on the electrical properties of n-type 4H-SiC MOS capacitors is studied. Phosphorus ions are implanted into the epitaxial layers prior to the deposition of SiO₂ by PECVD, in shallow depths and at concentrations at the oxide-semiconductor interface in the range of (5 x 10¹⁷…1 x 10¹⁹) cm^-3. Those samples are compared with ³¹P-implanted 4H-SiC MOS capacitors with thermally grown oxides, which were primarily investigated in the previous work of the authors. It is shown that independently of the oxide technology phosphorus may lead to decrease of the density of interface traps, whose response time to the AC voltage is longer than 1 µs. The side-effect of the implantation of phosphorus is generation of the very fast interface states, which are able to follow the frequencies over 1 MHz.

Abstract: We report on the threshold voltage () instability under operating conditions after gate bias switches at constant drain voltage for n-MOSFETs fabricated on 4H silicon carbide (4H-SiC). This effect occurs at room temperature and close to the of the device. We show that the origin of the instability is electron trapping into SiO₂ over an energy barrier of (0.3-0.4) eV. These traps show similarities to traps previously observed in 4H-SiC MOS capacitors and labelled near interface traps (NITs). Further, the density of the traps can be reduced by one order of magnitude through post-oxidation annealing in nitric oxide atmosphere.

Abstract: Epitaxial graphene on silicon carbide (SiC) can easily be grown by thermal decomposition. A well-defined epitaxial interface between graphene and substrate is formed, especially when the silicon face of hexagonal polytypes is employed. It is found that as-grown monolayer graphene with interfacial buffer layer provides perfectly ohmic contacts to n-type SiC – even to low-doped epitaxial layers without contact implantation. Contact resistances to highly doped samples are competitive with conventional annealed nickel (Ni) contacts; a direct comparison of Ni and graphene contacts on 4H-SiC resulted in an one order of magnitude reduction of the contact resistance in the case of graphene contacts. On highly doped 6H-SiC, a specific contact resistance as low as ρ_C = 5.9·10^-6 Ωcm² was found. This further improvement compared to 4H-SiC is assigned to better matching of work functions at the Schottky-like interface.

Abstract: We have investigated the electrical properties of germanium-implanted n-type 4H-SiC epitaxial layers. Deep level transient spectroscopy (DLTS) was employed in order to study the influence of germanium ions on implantation-induced point defects. In particular, we observe a decrease of the concentration of Z_1/2 defect with increasing dose of implanted germanium.

Abstract: We present temperature dependent magnetoresistance measurements on the 2-dimensional electron gas of epitaxially grown AlGaN/GaN heterojunctions on silicon (Si). We report on the quantum correction to the classical conductance. In particular we found weak localization, electron-electron-interaction, and Shubnikov-de Haas oscillations. The results verify the high material quality of the investigated GaN on silicon.