Papers by Author: Hong Wei Fan

Abstract: The dressing principle of a newly developed metal bonded superabrasive tool named porous self-generation superabrasive tool (PSST) is introduced. It is found that the ‘soluble’ filler added in the bond material can be dissolved by certain solution, and porous structure can be formed on the highly compacted surface layer of the metal-bonded superabrasive tool. The dressing process of PSST are investigated by a series of lapping experiments. Surface topography of PSST during lapping process is observed. It is found that the porous structure can be maintained on the PSST surface layer during the lapping process. There is little jam happened on the PSST surface. The generated porous binder on PSST surface layer is more susceptible to bond fracture, which is benefit to the self-sharpening of the metal bonded superabrasive tool.

Abstract: To improve the sphericity and processing uniformity of precision ball, Simulations and analysis of the mechanism Position Deviation of Rotated Dual-Plates Lapping on precise Sphere, it can be indicated that mechanism Position Deviation (down plate axial deviation and down plate radial deviation) have little disadvantageous influence on sphericity and processing uniformity.

Abstract: In order to obtain low surface damage and high machining efficiency for advanced ceramics, overcome clogging and dressing difficulties of traditional metal bonded super-hard abrasive, a novel fine super-hard abrasive with porous self-generating ability is proposed in this paper. And the matching of filler and dissolvent in abrasive are studied. Soluble filler is a key technology of porous self-generating fine super-hard abrasive. In this paper, metal, metal oxide and non-metallic oxide are respectively used as soluble fillers. Results of the experimental shows: In metal bonded super-hard abrasive, metal, metal oxide and non-metallic oxide as soluble filler are feasible, correspondingly, FeCl3 solution, aqueous solution and weak alkaline solution are used as dressing dissolvent, respectively. It can be met the requirement of high precision machining for advanced ceramic materials, hard and brittle machining materials.