Papers by Author: Hui Huang

Abstract: In this paper, in-situ wetting and spreading behaviours of the binary Sn-Ti alloys with Ti contents were investigated on poly-crystalline CVD diamond plates. The variation of contact angles at increasing temperatures indicated the wettability of Sn-Ti alloys were strongly influenced by the Ti contents. Addition of small amount of Ti (0.5 wt.%) dramatically reduced the contact angle of Sn-Ti alloys; while a relatively high Ti concentration (above 4 wt.%) induced the formation of large refractory intermetallics phase, which reduced the fluidity and impeded the spreading of Sn-Ti alloys.

Abstract: In this paper, a preliminary study in the wetting behavior and interface reaction between active Sn-Ag-4Ti solder alloy and C-plane sapphire was given. An in-situ observation of Sn-Ag-4Ti alloy on C-plane sapphire revealed a decrease in contact angles at temperature close to 550°C. Moreover, sapphire/sapphire and sapphire/copper sandwich joints were brazed using Sn-3.5Ag-4Ti alloy at 500 ^oC, 550°C and 600 °C to investigate the microstructure evolution and interface reaction. Microstructure characterization and element analysis indicated that the temperature affected the diffusion of active Ti element by modifying the formation of Sn-Ti intermetallics compounds in Sn-Ag-Ti solder alloy. The absorption of Ti together with the release of Al from sapphire suggested the interface reaction between Sn-Ag-Ti alloy and sapphire was triggered at 550°C.

Abstract: The wear behavior of monolayer brazed diamond beads was investigated during wire sawing of granite. Diamonds were bounded onto the beads by brazing in vacuum. Brazed beads were abrasive sawed on a wire sawing machine and the wear of the brazed diamond beads were traced and observed by using a digital microscope. The results reveal that the wear of root fractured, characterized by breaking off grit at its bonding level, was the fatal failure of the cutting ability of grit as well as the main wear behavior of brazed grits on brazed bead.

Abstract: The dynamic mechanical properties of oxygen free copper has been tested under the different strain rate (4700s-1~21000s-1) at the room temperature by split Hopkinson pressure bar (SHPB), the true stress-true strain curves has been obtained. Power-Law constitutive model and Johnson-Cook constitutive model have been built to fit the experimental result from SHPB test of oxygen free copper, meanwhile, the constitutive model can be applied to the simulation analysis of cutting process. The results show that the oxygen free copper is sensitive to the strain rate. In addition, the Johnson-Cook constitutive model predicts the plastic flow stress of the oxygen free copper more accurately than the Power-Law constitutive model at the high strain rate.

Abstract: Rocking motion wire saw with the additional rocking motion of either the wire or the workpiece is a new machining method compared with the traditional wire saw. The length of contact between the wire and the workpiece changes in this new saw process. In this paper, the wire motion and the contact length were theoretically researched. Wire motion path equation with the rocking motion was established. The theoretical equation of the contact length in half a swing period was derived out. The results indicated that the wire motion was a single pendulum movement with a length line segment, which the swing pivot was moved with a feed rate. The contact length had significant changes in half a swing period in the rocking motion wire saw. The contact length varied periodically with the same amplitude in the square ingot sawing, which varied periodically with the variation amplitude in the circle ingot sawing. The contact length with the rocking motion was obviously shorter than the case without the rocking motion for either the square ingot or the circle ingot.

Abstract: Strengthening the study on whiskers influence on the reliability of lead-free soldering can improve welding technology and contribute to the overall development of the electronics industry. This paper provides an overview of the study on lead-free solder technology and development, summaries the materials, processes and other reliability issues and welding reliability problems of lead-free solder, finally gives an overview of the research status of whiskers formation mechanism and reliability.

Abstract: In this paper, diamond abrasive SG films were prepared by means of sol-gel technology for polishing single-crystal SiC wafers. The effects of machining parameters on processing quality including pressure, rotating speed and polishing time were investigated, respectively. The results indicated that the surface roughness decreased with increasing polishing time. While for pressure and rotating speed, there were inflections existing. Polishing SiC wafer under optimized machining parameters, an ultra smooth surface with the roughness of 3.7 nm could be achieved using 40 μm diamond grits.

Abstract: t is challenging to achieve good surface quality and high efficiency simultaneously when machining thin film solar panels. In this study the machining characteristics of a multilayered thin film structure were investigated using diamond wire sawing and grinding. It was found that the efficiency in sawing was significantly greater than that of the employed grinding process, but the machined surface quality was much worse. The results indicated that grinding could still be the solution for such processing and sawing must be improved before this technology could be further progressed for machining thin film multilayered structures.

Abstract: An experimental investigation is reported on the temperatures and energy partitions involved in the grinding of cemented carbide (YT30) with a vacuum brazed diamond wheel. The grinding temperature at the wheel-workpiece interface was measured using a pair of grindable foil thermocouples and the energy partition to the workpiece was evaluated by matching the analytical temperatures to the measured results. Effects of the various grinding conditions, including wheel velocity, feed rate and depth of cut, on the temperatures and the energy partition were investigated. It was determined that the wheel velocity was the most significant factor in governing the temperature relative to the depth of cut and feed rate. The maximum temperature rise at the contact zone was below 25°C in the present study. Microscopic examination of the ground surfaces and the ground detritus revealed that brittle fracture was the dominant material-removal mode. This may be one of the reasons for the low grinding temperature in grinding YT30 with a vacuum brazed diamond wheel. The energy partition values to the workpiece obtained under different grinding conditions varied from 3.3% to 20% for dry grinding YT30.

Abstract: Fixed-abrasive wire saw, with its ability to cut hard brittle material, such as silicon ingots, crystals and quartz, has emerged as a leading technology for production in semiconductor and photovoltaic industry. There are some defects in conventional fixed-abrasive wire saw such as significant low holding abrasive ability, low machining efficiency, high running costs, etc. A new fixed-abrasive wire, namely brazed diamond wires have been developed to overcome these problems. In this paper, brazed diamond wire were carried out to braze two different size diamond grits onto two different thin steel wires by using a nickel-based powder as brazing alloy. The mechanical properties of brazed diamond wire were evaluated by tensile and breaking twist experiment. The experimental results showed that the heating in the brazing process has litter influence on the wire mechanical properties. The addition of brazed alloy and diamond grits sharply decreased the wire mechanical properties significantly, both in the tensile strength and breaking twist angle. Bigger diamond grit would make the accumulation of brazed alloy which leaded to the deterioration of diameter consistency of wires.