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CONFERENCE
12/9/2012 - 12/12/2012
ACAM7: The 7th Australasian Congress on Applied Mechanics
11/16/2012 - 11/18/2012
2nd International Conference on Manufacturing Engineering and Automation (ICMEA2012)
11/16/2012 - 11/18/2012
more...
Articles by author: J.L. Besson
14 papers on 1 page:
1
Compressive Creep and Stress Relaxation Kinetics in a High Purity Silicon Nitride Ceramics in the 1400-1650 °C Range
Published in:
Creep and Fracture of Engineering Materials and Structures
(p817)
Creep and Oxidation Behaviour of a TiN-TiB
2
Composite Material
Published in:
High Temperature Corrosion and Protection of Materials 5
(p427)
Cyclic Behavior of Metal-Matrix Composites: An Experimental and Theoretical Investigation
Published in:
Ceramic and Metal Matrix Composites
(p1175)
Effects of Temperature on Viscosities and Elastic Modulus of Oxynitride Glasses
Published in:
Silicon Nitride '93
(p351)
Fabrication and Creep Behavior of SiCN(O) Nanocomposites
Published in:
Euro Ceramics VIII
(p2343)
Fabrication and Fracture Behavior of TiN-TiB
2
/Cu/TiN-TiB
2
Sandwich Composites
Published in:
Euro Ceramics VIII
(p845)
High Temperature Mechanical Behaviour of Glass-Ceramics in the YSiAlON and ErSiAlON Systems
Published in:
Nitrides and Oxynitrides 2
(p71)
Nanocomposites Si
3
N
4
/SiCN: Influence of SiC Nanoprecipitates on the Creep Behaviour
Published in:
Euro Ceramics V
(p1970)
Preparation and Microstructure of Liquid Phase Sintered SiC Laminar Materials
Published in:
Euro Ceramics VII
(p1017)
Preparation of Pure B-Phase Glass-Ceramic in the Yttrium SiAION System
Published in:
Euro Ceramics V
(p814)
Shear Viscosity of an Oxynitride Glass Interlayer
Published in:
Euro Ceramics V
(p563)
SiCN Nanocomposites : Powder Synthesis, Materials Processing and Ductility Assessment
Published in:
Euro Ceramics VII
(p1081)
Structural Characterisation of New Y-Si-Al-O-N Oxynitride Glass Ceramics
Published in:
Euro Ceramics V
(p794)
Superplastic forming of Si
3
N
4
and Si
3
N
4
/SiC Nanocomposites
Published in:
Superplasticity in Advanced Materials - ICSAM-97
(p233)
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