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CONFERENCE
6/16/2013 - 6/19/2013
The 7th International conference on Physical and Numerical Simulation of Materials Processing
5/16/2013 - 5/19/2013
2nd International Congress on Advanced Materials
4/13/2013 - 4/14/2013
2013 2nd lnternational Conference on lntclligent Materials, Applied Mechanics and Design Science (IMAMD 2013)
more...
Articles by author: Jian Xiu Su
11 papers on 1 page:
1
An Analyzing on Material Removal Mechanism in Chemical Mechanical Polishing of Cu
Published in:
Advances in Grinding and Abrasive Technology XV
(p354)
Analyzing on Nonuniformity of Material Removal in Silicon Wafer CMP Based on Abrasive Movement Trajectories
Published in:
Surface Finishing Technology and Surface Engineering
(p119)
Experiment on Non-Uniformity of Material Removal on Wafer Surface in Wafer CMP
Published in:
Application of Diamond and Related Materials
(p187)
Friction Characteristic of Wafer Surface in Chemical Mechanical Polishing
Published in:
Advances in Abrasive Technology VIII
(p389)
Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer
Published in:
Advances in Materials Manufacturing Science and Technology
(p362)
Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer
Published in:
Advances in Materials Manufacturing Science and Technology
(p26)
Study on Characteristic of Abrasives in Chemical Mechanical Polishing of Silicon Wafer
Published in:
Digital Design and Manufacturing Technology
(p658)
Study on Contact Mechanism of Interface in Wafer CMP Based on Abrasion Behavior
Published in:
Advances in Grinding and Abrasive Technology XIV
(p254)
Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process
Published in:
Surface Finishing Technology and Surface Engineering II
(p90)
Study on Subsurface Damage Model of the Ground Monocrystallinge Silicon Wafers
Published in:
Advances in Grinding and Abrasive Technology XV
(p66)
Study on the Surface Characteristics of Polishing Pad Used in Chemical Mechanical Polishing
Published in:
Digital Design and Manufacturing Technology
(p724)
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