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Articles by author: Jian Xiu Su

• An Analyzing on Material Removal Mechanism in Chemical Mechanical Polishing of Cu
  Published in: Advances in Grinding and Abrasive Technology XV (p354)
• Analyzing on Nonuniformity of Material Removal in Silicon Wafer CMP Based on Abrasive Movement Trajectories
  Published in: Surface Finishing Technology and Surface Engineering (p119)
• Experiment on Non-Uniformity of Material Removal on Wafer Surface in Wafer CMP
  Published in: Application of Diamond and Related Materials (p187)
• Friction Characteristic of Wafer Surface in Chemical Mechanical Polishing
  Published in: Advances in Abrasive Technology VIII (p389)
• Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer
  Published in: Advances in Materials Manufacturing Science and Technology (p362)
• Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer
  Published in: Advances in Materials Manufacturing Science and Technology (p26)
• Study on Characteristic of Abrasives in Chemical Mechanical Polishing of Silicon Wafer
  Published in: Digital Design and Manufacturing Technology (p658)
• Study on Contact Mechanism of Interface in Wafer CMP Based on Abrasion Behavior
  Published in: Advances in Grinding and Abrasive Technology XIV (p254)
• Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process
  Published in: Surface Finishing Technology and Surface Engineering II (p90)
• Study on Subsurface Damage Model of the Ground Monocrystallinge Silicon Wafers
  Published in: Advances in Grinding and Abrasive Technology XV (p66)
• Study on the Surface Characteristics of Polishing Pad Used in Chemical Mechanical Polishing
  Published in: Digital Design and Manufacturing Technology (p724)