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Articles by author: Jin Goo Park

• A Study on Water-Mark Defects in Copper/Low-k Chemical Mechanical Polishing
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p295)
• A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process
  Published in: Advances in Abrasive Technology VI (p433)
• Acoustic Field Analysis of a T Type Waveguide in Single Wafer Megasonic Cleaning and its Effect on Particle Removal
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p229)
• Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p275)
• Adhesion and Removal of Silica and Ceria Particles on the Wafer Surfaces in STI and Poly Si CMP
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p159)
• Analyzing the Collapse Force of Narrow Lines Measured by Lateral Force AFM Using an Analytical Mechanical Model
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p55)
• Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance
  Published in: Advances in Abrasive Technology VI (p389)
• Effect of Ozone Supply Methods on PRE in Alkaline Ozone Solutions
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p237)
• Effects of Interfacial Strength and Dimension of Structures on Physical Cleaning Window
  Published in: Ultra Clean Processing of Semiconductor Surfaces X (p123)
• Effects of Patterns on Corrosion in Cu CMP
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p369)
• Pattern Collapse and Particle Removal Forces of Interest to Semiconductor Fabrication Process
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p47)
• Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization
  Published in: Advances in Abrasive Technology V (p223)
• Prevention of Condensation Defects on Contact Patterns by Improving Rinse Process
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p151)
• Removal of Slurry Residues in Tungsten Plug during Chemical Mechanical Planarization
  Published in: Advances in Nanomaterials and Processing (p157)
• The Dependence of Chemical Mechanical Polishing Residue Removal on Post-Cleaning Treatments
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p303)