Papers by Author: Jin Ho Joo

Abstract: We fabricated by metal organic deposition (MOD) using trifluoroacetic acid (TFA) via the “211 process”, and then evaluated the phase formation, texture evolution, and critical properties as a function of the firing temperature and film thickness. In the fabrication process, Y2Ba1Cu1Ox and Ba3Cu5O8 powders were used as precursors instead of Y-, Ba- and Cu-based acetates. The films were fired in the temperature range of 750°C -800°C and the film thickness of films was controlled by repeating the number of coating cycles. The microstructure varied significantly with the firing temperature. The grains size increased, the film became denser, and the degree of the texture and phase purity varied with increasing firing temperature. The films fired at 775°C after calcining at 4005 showed the highest critical current (Ic) of 18 A/cm-width, which corresponds to a critical current density (Jc) of 0.9 MA/cm2. For multi-coated films, the Ic increased from 18 in the singly coated film to 100 A/cm-width with the triply coated film. In contrast, the corresponding Jc were in the range of 0.9-1.2 MA/cm2. Both Ic and Jc values decreased as the coating number repeated further as a result of the degraded microstructure.

Abstract: Bi-2223/Ag tapes are usually used for superconducting power cables and magnets. Bi- 2223 ceramic superconducting core can be damaged under complicated stress and strain conditions such as winding tension, bending and twisting. In this study, we have presented the effect of axial stress and bending strain on the superconducting properties of Bi-2223/Ag tapes. In order to establish the value for 95% retained Ic of the Bi-2223/Ag tapes under various stress-strain conditions, the tension apparatus with bending former was used to apply the tension and bending stress-strain. Tension and bending stress-strain simultaneously applied to the tapes could reduce the critical current even though each applied stress and strain values were not higher than that of 95% retained Ic of the tapes. Complex stress-strain conditions including the thermal stress-strain have accelerated the degradation of the Bi-223/Ag tapes. The deformation temperature was important to maintain the 95% retained Ic of the Bi-2223/Ag tapes after bending or tension deformation because mechanical strength of the tapes can be changed drastically between room temperature and 77 K.

Abstract: Cube textured Ni substrate were fabricated for YBCO coated conductors from the initial specimens prepared by powder metallurgy (P/M) and casting and the effects of annealing temperature and reduction ratio on texture formation and microstructural evolutio were evaluated. The initial specimens were rolled by 98.6% and 99.2% reduction ratio and then annealed in the temperature range of 600°C to 1200°C. The microstructure and texture were evaluated by optical microscopy and X-ray pole-figure analysis. We observed that microstructure of the initial specimen varied with preparation methods.Texture analysis indicated that a strong cube texture formed for substrate made by P/M, and the degree of texture did not significantly vary with annealing temperature of 600°C~1100°C. On the other hand, the texture of substrate made by casting was more dependent on the annealing temperature and twin texture ({221}<221>) and several minor texture components started to form at 1000°C. In addition, the texture of substrate made by P/M was significantly dependent on the reduction ratio.

Abstract: We fabricated YBCO film using a TFA-MOD method and evaluated the phase formation, texture evolution, and critical properties as a function of the firing temperatures. In order to enhance the reaction kinetics and to control the formation of the second phases, Y2Ba1Cu1Ox and Ba3Cu5O8 powders were used as precursors (the so called “211 process”), instead of Y-, Ba-, and Cu-based acetate, and dissolved in trifluoroacetic acid (TFA). The films were calcined at 460°C and then fired at 750°C-800°C in a 12.1% humidified Ar-O2 atmosphere. We found that the microstructure varied significantly with the firing temperature; the grain grew further and the film became denser as the firing temperature increased. The textures of all of the films were similar and mainly biaxial. On the other hand, the intensity of the major and minor texture components differed from each other. For the film fired at 775°C, the critical current was obtained to be 39 A/cm-width (corresponding critical current density is 2.0 MA/cm2), which was probably attributed to such factors as the enhanced phase purity and out-of-plane texture, the moderate film density and grain size, and crack-free surface.

Abstract: We fabricated Bi-2212/SrSO4 composite superconductors by the melt casting process and evaluated the effects of the powder mixing method and melting temperature on their microstructure and superconducting properties. In the melt casting process, the Bi-2212 powders were mixed with SrSO4 by hand-mixing (HM) and planetary ball milling (PBM) and then the powder mixtures were melted at 1100°C~1200°C, solidified, and annealed. We found that the powder mixture prepared by PBM was finer and more homogeneously mixed than that prepared by HM, resulting in more homogeneous microstructure and smaller SrSO4 and second phases after annealing. The critical current (Ic) also varied significantly with the powder mixing method and the melting temperature. The Ic of the annealed rod prepared by PBM was 193 A at 77 K when melted at 1100°C, which is higher than that of the annealed rod prepared by HM (132 A). This enhancement in the Ic value for the former is considered to be due to its more uniform microstructure.

Abstract: Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

Abstract: We studied the effects of the processing variables on the texture development of Ni tapes prepared from Ni powder compact rods. The Ni power was compacted into rods by cold isostatic pressing(CIP). The CIP-processed Ni rods were sintered for densification and made into Ni tapes of 100 microns by cold rolling. For the development of a cube texture, the rolled Ni tapes were annealed at various temperatures. The brass texture was converted into a cube texture during annealing and the degree of the formed cube textured was dependent on the annealing temperature. We analyzed the (200) cube texture by X-ray diffraction and pole figure analysis and EBSD(Electron beam backscattered diffraction pattern).