Papers by Author: Jonathan Sim

Abstract: Bi₂Te₃ and its solid solution remain the state-of-the-art thermoelectric materials for refrigeration applications in microelectronics industry, such as dissipating the heat generated by various devices. The fabrication method and associated processing parameters are to be optimised to get desirable composition exhibiting better electrical and thermal transport properties. Carrier concentration and mobility are found to be crucial in achieving high thermoelectric cooling efficiency and energy conversion. In this paper, we present the fabrication and analysis of thermoelectric thin films deposited by RF-magnetron sputtering from n-type Bi₂Te_2.7Se_0.3 and p-type Bi_0.5Sb_1.5Te₃ targets on a silicon substrate. X-ray diffraction, Scanning electron microscopy combined with energy dispersive spectrometry, electrical resistivity, Seebeck coefficient and thermal diffusivity measurements were used for the thermoelectric thin films characterization. We studied the effect of sputtering process parameters, on the structural, electrical and thermal transport characteristics of films. The observed results demonstrate both n-and p-type doped Bi₂Te₃ films exhibit desirable properties and could be potential candidates for thermoelectric micro-cooler applications.

Abstract: Thermoelectric is an ever evolving field that serves many critical needs (cooling and power generation) in the industry. The key objective of this work is to fabricate Bismuth Telluride (Bi₂Te₃) thin-films by varying the various process parameters using a radio-frequency (RF) magnetron sputtering disposition technique. Characterization methods such as four point probe resistivity, surface profiler, atomic force microscopy (AFM), X-ray diffraction (XRD), Seebeck coefficient and thermal diffusivity are performed on the N and P-type Bi₂Te₃ films. The samples are analysed for their electrical properties in relation to the evolved microstructures, for how the process parameters of sputtering and annealing affect these changes. The results demonstrate that N-Type film (S2) processed using sputtering parameters of 7mT, 100W, 50sccm of argon flow under room temperature for 30mins with no annealing and the P-Type film processed using sputtering parameters of 7mT, 100W, 60sccm under room temperature for 30mins with institute annealing at 200°C for 2h exhibit desirable thermoelectric properties suitable for cooling application in microelectronic and optoelectronic devices, optimizing their performance and reliability.