Articles by author: Jun Shimizu
-
Mold Fabricated by Nanoscratching for Nanoimprint Lithography
Published in: Advances in Abrasive Technology XIII (p843) -
Molecular Dynamics Analysis of Ultra High-Acceleration and Vibration Cutting
Published in: Advances in Abrasive Technology VI (p21) -
Molecular Dynamics Simulation of Chemo-Mechanical Grinding (CMG) by Controlling Interatomic Potential Parameters to Imitate Chemical Reaction
Published in: Advances in Abrasive Technology XII (p82) -
Molecular Dynamics Simulation of Rubbing Phenomena in Ultra-Precision Abrasive Machining
Published in: Advances in Materials Processing IX (p417) -
Spectroscopic Measurements of Silicon Wafer Thickness for Backgrinding Process
Published in: Advances in Abrasive Technology XIV (p672) -
Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer
Published in: Advances in Abrasive Technology XI (p13) -
Study on Path Control Scheme by Laplacian Potential Field and Configuration Space for Vision Guided Micro Manipulation System
Published in: Advances in Abrasive Technology XII (p725) -
Study on Structure Transformation of Si Wafer in Grinding Process
Published in: Advances in Abrasive Technology IX (p373)