Papers by Author: K.Yu. Shunyaev

Abstract: The thermal and microstructural properties of five copper-gallium-tin alloys (Cu-Ga-Sn) and two important intermetallic compounds Cu₃Sn and CuGa₂ have been investigated by dilatometry, scanning electron microscopy (SEM) equipped with energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction. The temperature dependence of thermal expansion and coefficient of linear thermal expansion (CLTE) were obtained.