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Articles by author: Karen Maex

• Characterization of HF Cleaning of Ion-Implanted Si Surfaces
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p271)
• Copper Deposition and Subsequent Grain Structure Evolution in Narrow Lines
  Published in: THERMEC'2003 (p2485)
• Deep Levels in Silicon as a Result of CoSi₂ Formation
  Published in: Defects in Semiconductors 15 (p183)
• Defectivity Study of Cu Metallization Process by Dark- and Bright-Field Inspection
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p281)
• Evaluation of Post Metal Etch Cleaning by Analyzing the Chemical Compositions and Distributions on the Etched Al Surface
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p177)
• Interaction Forces between Oxide and Silica-Modified Terpolymer Abrasive and their Impact on CMP and Post-CMP
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p169)
• Metal In-Diffusion during Fe and Co-Germanidation of Germanium
  Published in: Gettering and Defect Engineering in Semiconductor Technology XII (p47)
• Modification of Low-K SiCOH Film Porosity by a HF Solution
  Published in: Ultra Clean Processing of Silicon Surfaces V (p135)
• Post Dry-Etch Cleaning Issues of an Organic Low-K Dielectric
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p89)
• RTP Requirements for CMOS Integration of Dual Work Function Phase Controlled Ni-FUSI (Fully Silicided) Gates with Simultaneous Silicidation of nMOS (NiSi) and pMOS (Ni-Rich Silicide) Gates on HfSiON
  Published in: Rapid Thermal Processing and beyond: Applications in Semiconductor Processing (p341)
• Thermomechanical Properties of Nickel Silicide: Dependence on the Microstructure
  Published in: Textures of Materials - ICOTOM 14 (p1431)