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Articles by author: Lucile Broussous

• "Damage Free" Cleaning for Advanced BEOL Interconnections
  Published in: Ultra Clean Processing of Semiconductor Surfaces X (p211)
• Barrier and Copper Seedlayer Wet Etching
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p361)
• Copper Decontamination Ability of Supercritical-CO₂/Additives on CVD and Spin-On Porous MSQ Materials
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p327)
• Copper Surface Analysis with ToF-SIMS: Spectra Interpretation and Stability Issues
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p371)
• Electrochemical Behavior of Cobalt in Post-Via Etch Cleaning Solutions
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p343)
• Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p333)
• Impact of Plasma and Diluted HF on a CoWP Material
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p321)
• Porous Low-k Wet Etch in HF-Based Solutions: Focus on Cleaning Process Window, "Pore-Sealing" and "k Recovery"
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p295)
• Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p263)
• Single Backside Cleaning on Silicon, Silicon Nitride and Silicon Oxide
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p249)