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Articles by author: Marc M. Heyns

• A Controlled Deposition of Organic Contamination and the Removal with Ozone Based Cleanings
  Published in: Ultra Clean Processing of Silicon Surfaces V (p223)
• A Force Study in Brush Scrubbing
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p279)
• A New HF Vapor Process for Native Oxide Removal, Suited for Cluster Applications
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p225)
• A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p165)
• A Study of the Influence of Typical Wet Chemical Treatments on the Germanium Wafer Surface
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p27)
• Behaviour of Metallic Contaminants during Mos Processing
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p11)
• Can we Increase the Effiency of Organic Contamination Removal by Ozone/DI-Water Processes by Using Additives?
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p215)
• Crystallisation and Tetragonal-Monoclinic Transformation in ZrO₂ and HfO₂ Dielectric Thin Films
  Published in: Euro Ceramics VII (p1285)
• Determination of Photoresist Degradation Products in O₃/DI Processing
  Published in: Ultra Clean Processing of Silicon Surfaces V (p207)
• Differential Interference Contrast Microscopy of Defects in As-Grown and Annealed Si Wafers
  Published in: Gettering and Defect Engineering in Semiconductor Technology VII (p387)
• Effect of Additives on the Removal Efficiency of Photoresist by Ozone/DI-Water Processes: Experimental Study
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p101)
• Effect of Si Surface Roughness on the Current-Voltage Characteristics of Ultra-Thin Gate Oxides
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p249)
• Effect of Transient pH on Particle Deposition during Immersion Rinsing
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p139)
• Electrical Evaluation of the Epi/Substrate Interface Quality after Different In-Situ and Ex-Situ Low-Temperature Pre-Epi Cleaning Methods
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p237)
• Etch Rate Study of Germanium, GaAs and InGaAs: A Challenge in Semiconductor Processing
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p203)