Papers by Author: Pai Shan Pa

Abstract: A new effective fabrication module was developed to mediate the problem of the low yield of Indium-tin-oxide (ITO) nanostructures deposition uses micro electroremoval technology and a design of twins-cylinder tool as a precision etching process to remove the defective Indium-tin-oxide (ITO) from the optical PET diaphragm surfaces of digital-paper displays. For the removal-process, a small gap width between the negative electrode and the workpiece (optical PET diaphragm) surface corresponds to a higher removal rate for the ITO. A small diameter of the anode or a small diameter of the cathode of the twins-cylinder tool provides large electric current density and takes less time for the same amount (20 nm) of ITO removal. High rotational speed of the twins-cylinder tool the discharge mobility and results in improving the removal effect. Providing enough electrical power can uses fast feed rate of the optical PET diaphragm combined with a fast removal rate for ITO. With increasing in current rating, pulsed direct current can improve the effect of dregs discharge and is advantageous to associate with the fast feed rate of the optical PET diaphragm. By establishing a recycling process using the ultra-precise removal of thin-film nanostructures, through the micro electroremoval and the twins-cylinder electrodes requires only a short period of time to remove the ITO thin-film easily and cleanly. The optoelectronic semiconductor industry can effectively recycle defective products, minimizing both production costs and pollution.

Abstract: For the purpose of elevating the efficiency of the finish effect to reach the fast improvement of the surface roughness of the plane surface, so as to reduce the residual stress on the surface efficiently. This study discusses the plane surface after traditional grinding machining, of which the plane surface used a new design of finish-tool includes a nonconductive burnishing-tool and a negative electrode to execute the simultaneous processes of burnishing and electrofinishing. In the experiment, the use of the small thickness of the negative electrode is advantageous to the finish effect. High rotational speed of the finish-tool produces better polishing. Higher current rating with quicker workpiece feed rate effectively reaches the fast improvement of the surface roughness of the workpiece. The finishing effect is better with longer off-time because discharge of the electrofinishing dregs becomes easier. The experimental results show that the supply of current rating is near concern with the position of the negative electrode and the burnishing-tool.

Abstract: The low yield rate of the transparent conducting oxide (TCO) is easily existent through the processes of semiconductor production. A nanotechnology system of the recycling process for removing the TCO-layer from displays’ color filter surface of computer display is presented. By establishing a recycling process for the ultra-precise removal of the thin film nanostructure, the semiconductor optoelectronic industry can effectively reclaim defective products, reducing both production costs and pollution for the technical application. In the current experiment, the major interest is the design mechanism features of the removal process for a thin layer of TCO and an effective design dumbbell-tool. For the recycling processes, a small diameter of the positive-electrode, a small gap-width between the negative-electrode and the positive-electrode corresponds to a higher removal rate for the TCO-layer. A high rotational speed of the dumbbell-tool, or a high flow velocity of the electrolyte increases the dreg discharge mobility and improves the removal effect. A higher working temperature or a higher concentration of the electrolyte corresponds to a higher removal rate for the TCO-layer. An enough electric power corresponds with a higher feed rate of the displays’ color filter produces a fast removal rate and reduces the production costs. An effective design of the system mechanism and the machining tool in the electroremoval processes requires quite a short time to make the TCO-layer remove easily and cleanly.

Abstract: A new finishing method of holes that uses an effective electrode and a nonconductive roller to execute the design of synchronous processes of ultrasonic electrochemical finishing and rolling-leveling is investigated. The submitted processes can be used among the traditional techniques of various holes machining. Through simple equipment attachment, ultrasonic electrochemical finishing and rolling-leveling can follow to execute the finishing process on the same machine. Among the factors affecting finishing processes, the performance of rolling-leveling combined with ultrasonic electrochemical finishing is primarily discussed. In the experiment, the electrode is used with continuous and pulsed direct current. The controlled factors include roller material, roller geometry, chemical composition and concentration of the electrolyte, and flow rate of electrolytes. The experimental parameters are frequency and power level of ultrasonics, feed rate of electrode and roller, rotational speed of the finish-tool, die material, electrical current rating, and pulsed period. The design of the synchronous processes through rolling-leveling is the most influential parameter in this study. An adequate finish-tool rotational speed produces better finishing. The average effect of the ultrasonic is better than the pulsed current while the machining time needs not to be prolonged by the off-time. An effective and low-cost finishing process through the ultrasonic electrochemical finishing and using the rolling-leveling assistance after the process of traditional holes machining make the surface of the holes smooth and bright is presented.

Abstract: Although the low yield rate of ITO thin-film during the production of semiconductor techniques is easily seen. Current work presents a new modus of electrochemical machining using a design rolling tool as electrodes constructs a precision recycle process offering faster performance in removing the color filter surface’s ITO thin-film. Through establishing an ultra-precise recycling process to remove the thin-film microstructure, this helps the semiconductor optoelectronic industry to reduce both production costs and pollution. The design features of the removal processes for a thin-film and the tool design of rolling electrodes are of major interest. Higher electrical current is not required when an effective feeding electrodes is used to reduce the response area. In the current experiment, the author utilizes a 5th Generation TFT-LCD. The design electrodes (rolling tool) are used with continuous and pulsed direct current in the electrochemical machining experiment. A displays’ color filter with a fast feed rate is combined with enough electric power to provide highly effective removal. High rotational speed of the rolling tool and high flow velocity of the electrolyte elevates the discharge mobility and improves the removal effect. A larger diameter of the fictitious rotation circle of the cathode and a small end radius of the cathode provide better removal effect. A precision recycling process is presented using an effective rolling tool in the electrochemical machining. It only needs a short period of time to remove the ITO thin-film easily and cleanly.

Abstract: The current study involves the use of ultrasonic vibration of the electrolyte to assist in removing electrolytic product and cuttings from the machining gap in the surface finish process of grinding and electro-finishing the inside surface of a tapered hole. The design of the finish-tool includes a taper grinding-tool joined to an electrode. In the experiment, the finish-tool is gradually fed into the taper hole and the electrode is used with continuous or pulsed direct current. The experimental results show that a high current together with ultrasonic vibration is effective in material removal and in the improvement of the finishing effect. The average effect of the ultrasonic vibration is greater than that of the pulsed current while the machining time need not be longer than the off-time. The finishing effect is better with a wide gap between the grinding-tool and the electrode. A high rotational speed of the finish-tool guides and discharges the dregs and cuttings efficiently and also improves the finish. The simultaneous use of ultrasonics with grinding and electro-finishing (SUGEF) also shortens the time it takes make the inside wall of the tapered hole smooth and bright.

Abstract: This study presents a new modus of selective removal technology and an excimer assistance on TFT-LCD above the five generation used to carry out the selective removal of nanostructures layers from optoelectronic flat panel displays’ color filter surface as well as the complete removal from the substrate of the ITO thin-films, RGB layer or resin BM layer. Displays’ color filters are produced using optoelectronic semiconductor fabrication techniques though the low yield during production can still be improved. Through the precise removal process of chemical etching and excimer assistance, the selective removals of different layers on top of color filter substrates will cut down the production costs. It can individually pick out and remove defective films or directly remove all films but the Cr layer or bare glass. Experimental results point out defective ITO thin-films, RGB layers, or resin BM layer can now be recycled with great precision. When the ITO proves difficult to remove, excimer-light can also be used to help with its removal. During the color filter recycle process the use of a 172nm excimer-light can remove stubborn film residues, effectively improving the quality of recycled color filters. This study offers a recovery module for defective diaplays’ color filters can be reused and fed back into the color filter production line, therefore provides many benefits in the industry of optoelectronic semiconductor.

Abstract: It is very difficult to execute the finishing process of the concavo-convex surface of female-screws. The current study offers a screw-form design electrode and a new area-finishing process using an ultrasonic generator. The ultrasonic energy generated is transmitted into the electrolyte to assist the process of electrochemical finishing. The surface of female-screws is electrochemically finished by different types of completely inserted electrodes and put through both continuous and pulsed direct current as a finishing operation. For inserted screw-form electrodes, a smaller circumference electrode on the cylinder provides more sufficient discharge space, which is advantageous for finishing. Pulsed direct current can promote the effect of electrochemical finishing, but the machining time is longer and the cost is raised. The average ultrasonic effect is much better than the pulsed current while the machining time needs not be prolonged by the off-time. The higher current density and higher current rating with ultrasonic assistance can avoid the difficulty of dreg discharge, thus reducing the finishing time. It is a great contribution that the ultrasonic-assistance electrochemical finishing after screw machining requires a shorter time than manual or machine polishing to make the surface of female screws smooth and bright.

Abstract: In the current study, a reclamation module uses micro electroetching as a precision fabrication with a new design of T-form tool to remove the defective Indium-tin-oxide (TCO) nanostructure from the optical PET surfaces of digital paper display is presented in current studies. The adopted precision reclamation process requires only a short period of time to remove the TCO nanostructure easily and cleanly is based on technical and economical considerations and is highly efficient. A large rotational diameter of the cathode accompanied by a small gap width between the cathode and the workpiece corresponds to a higher removal rate for the TCO nanostructure. A small thickness of the electrodes, or a small edge radius of the electrodes takes less time for the same amount of TCO removal. A higher feed rate of the optical PET diaphragm combines with enough electric power to drive fast etching rate. High rotational speed of the T-form tool can improve the effect of dregs discharge and is advantageous to associate with the fast feed rate of the workpiece (optical PET diaphragm).

Abstract: The low yield of ITO thin film deposition is an important factor in optoelectronic semiconductor production. A recycle fabrication module uses micro electroremoving as a precision machining process with a new design of inner wedge-form tool to remove the defective Indium-tin-oxide (ITO) nanostructure from the optical PET surfaces of digital paper display is presented in current studies. The adopted precision recycle process requires only a short period of time to remove the ITO nanostructure easily and cleanly is based on technical and economical considerations and is highly efficient. In the current experiment, a higher feed rate of the optical PET diaphragm combines with enough electric power to drive fast micro electroremoving. A large slant angle of the cathode and a small arc rounding radius of the anode takes less time for the same amount of ITO removal. High rotational speed of the electrodes can improve the effect of dregs discharge and is advantageous to associate with the fast feed rate of the workpiece (optical PET diaphragm). A small rotational diameter of the anode accompanied by a small width of the cathode corresponds to a higher removal rate for the ITO nanostructure.